AT32UC3B0512AU Atmel Corporation, AT32UC3B0512AU Datasheet - Page 55

• Manufacturer Part Number: AT32UC3B0512AU
• Manufacturer: Atmel Corporation

Specifications of AT32UC3B0512AU

• Flash (kbytes): 512 Kbytes
• Pin Count: 64
• Max. Operating Frequency: 60 MHz
• Cpu: 32-bit AVR
• # Of Touch Channels: 32
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 44
• Ext Interrupts: 44
• Usb Transceiver: 1
• Usb Speed: Full Speed
• Usb Interface: Device + OTG
• Spi: 4
• Twi (i2c): 1
• Uart: 3
• Ssc: 1
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 8
• Adc Resolution (bits): 10
• Adc Speed (ksps): 384
• Resistive Touch Screen: No
• Dac Channels: 2
• Dac Resolution (bits): 16
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 96
• Self Program Memory: YES
• Dram Memory: No
• Nand Interface: No
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 3.0-3.6 or (1.65-1.95+3.0-3.6)
• Operating Voltage (vcc): 3.0-3.6 or (1.65-1.95+3.0-3.6)
• Fpu: No
• Mpu / Mmu: Yes / No
• Timers: 10
• Output Compare Channels: 16
• Input Capture Channels: 6
• Pwm Channels: 13
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: Yes

10. Mechanical Characteristics
10.1
10.1.1
10.1.2
32059L–AVR32–01/2012
Thermal Considerations
Thermal Data
Junction Temperature
Table 10-1
Table 10-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
page
Table 10-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
55.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
55.
JA
)
42.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Package
TQFP64
TQFP64
TQFP48
TQFP48
Table 10-1 on
49.6
13.5
51.1
13.7
Typ
”Power
J
⋅ C/W
⋅ C/W
in °C.
Unit
55