C0805C223K1RAC7800 Kemet Corp., C0805C223K1RAC7800 Datasheet

C0805C223K1RAC7800

Manufacturer Part Number

C0805C223K1RAC7800

Description

Ceramic Chip Capacitors / Standard X7R; Capacitance [nom]: 0.022uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 0805;

Manufacturer

Kemet Corp.

Datasheet

1.C0805C223K1RAC7800.pdf (9 pages)

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* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)

+ For extended value 1210 case size - solder reflow only.

CERAMIC

SIZE CODE

SPECIFICATION

C - Standard

CAPACITANCE CODE

Expressed in Picofarads (pF)

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)

(Example: 2.2pF = 229 or 0.50 pF = 508)

CAPACITANCE TOLERANCE

B – ±0.10pF

C – ±0.25pF

D – ±0.5pF

F – ±1%

G – ±2%

• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics

• 10, 16, 25, 50, 100 and 200 Volts

• Standard End Metalization: Tin-plate over nickel

• Available Capacitance Tolerances: ±0.10 pF; ±0.25

EIA SIZE

barrier

pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

+80%-20%

CODE

0201*

0402*

0805*

1206*

1210*

1825*

0603

1808

1812

2220

2225

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

SIZE CODE

METRIC

0603

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

J – ±5%

K – ±10%

M – ±20%

P – (GMV) – special order only

Z – +80%, -20%

0.6 (.024) ± .03 (.001)

1.6 (.063) ± .15 (.006)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .20 (.008)

4.5 (.177) ± .30 (.012)

5.6 (.220) ± .40 (.016)

1.0 (.04) ± .05 (.002)

CAPACITOR ORDERING INFORMATION

DIMENSIONS—MILLIMETERS AND (INCHES)

L - LENGTH

CERAMIC CHIP CAPACITORS

* Part Number Example: C0805C103K5RAC

C 0805 C 103 K 5 R A C*

CAPACITOR OUTLINE DRAWINGS

0.3 ± (.012) ± .03 (.001)

1.25 (.049) ± .20 (.008)

0.8 (.032) ± .15 (.006)

1.6 (.063) ± .20 (.008)

2.5 (.098) ± .20 (.008)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .30 (.012)

6.4 (.252) ± .40 (.016)

5.0 (.197) ± .40 (.016)

6.3 (.248) ± .40 (.016)

0.5 (.02) ± .05 (.002)

W - WIDTH

FEATURES

for thickness

THICKNESS

See page 78

dimensions.

ELECTRODES

• Tape and reel packaging per EIA481-1. (See page

• RoHS Compliant

92 for specific tape and reel information.) Bulk

Cassette packaging (0402, 0603, 0805 only) per

IEC60286-6 and EIAJ 7201.

(14 digits - no spaces)

0.15 (.006) ± .05 (.002)

0.35 (.014) ± .15 (.006)

0.60 (.024) ± .35 (.014)

0.20 (.008) -.40 (.016)

0.50 (.02) ± .25 (.010)

B - BANDWIDTH

METALLIZATION

TEMPERATURE CHARACTERISTIC

CONDUCTIVE

C-Standard (Tin-plated nickel barrier)

TIN PLATE

G – C0G (NP0) (±30 PPM/°C)

R – X7R (±15%) (-55°C + 125°C)

P– X5R (±15%) (-55°C + 85°C)

U – Z5U (+22%, -56%) (+10°C + 85°C)

V – Y5V (+22%, -82%) (-30°C + 85°C)

Change Over Temperature Range

(Standard Chips - For

Military see page 87)

NICKEL PLATE

SEPARATION

0.75 (.030)

Designated by Capacitance

minimum

0.3 (.012)

0.7 (.028)

FAILURE RATE LEVEL

VOLTAGE

1 - 100V

2 - 200V

5 - 50V

1 - 100V 3 - 25V

2 - 200V 4 - 16V

5 - 50V

6 - 35V

7 - 4V

END METALLIZATION

N/A

A- Not Applicable

8 - 10V

9 - 6.3V

7 - 4V

Solder Wave +

Solder Reflow

TECHNIQUE

MOUNTING

3 - 25V

4 - 16V

8 - 10V

9 - 6.3V

Related parts for C0805C223K1RAC7800

C0805C223K1RAC7800 Summary of contents

Page 1

CERAMIC CHIP CAPACITORS • C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ...

Page 2

CERAMIC CHIP/STANDARD C0G CAPACITANCE RANGE – 1210, 1812, 1825, 2220, 2225 Cap CAP. CAP CAP CODE TOL. 0.5-2.4 508-249 D 10 100 C ,D 2.7-9.1 279-919 D 10.0-13.0 100-130 D 12 120 C ,D 15.0-24.0 150-240 D 15 ...

Page 3

CERAMIC CHIP/STANDARD C1210 Cap Cap Cap Tol. pF Code 6.3V 10V 16V 25V 50V 100V 200V 2,200 222 J,K 2,700 272 J,K 3,300 332 J,K,M FB ...

Page 4

CERAMIC CHIP CAPACITORS Packaging Quantity Based on Finished Chip Thickness Specifications Thickness Chip Chip Thickness Code Size Range (mm) AA 0201 0.30 ± 0.03 BB 0402 0.50 ± 0.05 CB 0603 0.80 ± 0.07 CC 0603 0.80 ± 0.10 CD ...

Page 5

CERAMIC CHIP CAPACITORS Tape & Reel Packaging 178mm (7.00") or 330mm (13.00") Case Sizes 1210 are 8 mm tape with 4 mm pitch. Case Sizes 1210 are 12 mm tape with 8 mm pitch. Note: TU suffix represents tape and ...

Page 6

TANTALUM, CERAMIC AND ALUMINUM CHIP CAPACITORS 1.0 Kg Minimum. The total peel strength of the cover tape from the carrier tape shall be The direction of the pull shall be opposite the direction of the carrier ...

Page 7

TANTALUM, CERAMIC AND ALUMINUM CHIP CAPACITORS Tape Camber (Top View) Tape Leader & Trailer Dimensions (Metric Dimensions Will Govern) Reel Dimensions (Metric Dimensions will govern 330.0 1.5 (12.992) (0.059 330.0 1.5 (12.992) (0.059) ©KEMET Electronics Corporation, ...

Page 8

CERAMIC CHIP CAPACITORS Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only): T Top Tape Cover Bottom Tape Cover T 1 User Direction of Feed Table 1: 8 & 12mm Punched Tape Constant Dimensions - Millimeters (Inches) Tape ...

Page 9

CERAMIC CHIP CAPACITORS Packaging Information 53.3* 10* 1.5 2.0 3.0 110 0.7 1005 0402 1.0 0.05 0.5 0.05 1608 0603 1.6 0.07 0.8 0.07 2012 0805 2.0 0.10 1.25 Terminations: KEMET nickel barrier layer with a tin overplate. A 0.10 ...

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