CGY1047,112 NXP Semiconductors, CGY1047,112 Datasheet
CGY1047,112
Specifications of CGY1047,112
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CGY1047,112 Summary of contents
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CGY1047 1 GHz gain GaAs push-pull amplifier Rev. 2 — 29 September 2010 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage (DC), employing Heterojunction Field ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number CGY1047 4. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter i(RF) V ESD T stg T mb [1] The value of 2000 V corresponds to a class 2 classification. CGY1047 Product data sheet ...
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... NXP Semiconductors 5. Characteristics Table 5. Characteristics Bandwidth 40 MHz to 1003 MHz; V Symbol Parameter G power gain p SL slope straight line sl FL flatness of frequency response RL input return loss in RL output return loss out NF noise figure I total current tot 79 NTSC channels + 75 digital channels CTB composite triple beat ...
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... NXP Semiconductors 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads DIMENSIONS (mm are the original dimensions UNIT b c max. max. max. 0.51 mm 20.8 9.5 0.25 27.2 0.38 OUTLINE VERSION IEC SOT115J Fig 1 ...
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... NXP Semiconductors 7. Abbreviations Table 6. Acronym CATV DC ESD NTSC RF UNC 8. Revision history Table 7. Revision history Document ID Release date CGY1047 v.2 20100929 • Modifications: Package outline drawings have been updated to the latest version. • Legal texts have been updated. CGY1047 v.1 20090730 CGY1047 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Legal information 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6 9 ...