MT58L64L32F Micron Semiconductor Products, MT58L64L32F Datasheet
MT58L64L32F
Specifications of MT58L64L32F
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MT58L64L32F Summary of contents
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... Operating Temperature Range Commercial (0°C to +70°C) Part Number Example: MT58L64L36FT-8.5 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_2.p65 – Rev. 6/01 2Mb: 128K x 18, 64K x 32/36 FLOW-THROUGH SYNCBURST SRAM ™ MT58L128L18F, MT58L64L32F, MT58L64L36F; MT58L128V18F, MT58L64V32F, MT58L64V36F 3. **JEDEC-standard MS-026 BHA (LQFP). GENERAL DESCRIPTION ...
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ADDRESS SA0, SA1, SA REGISTER MODE ADV# CLK ADSC# ADSP# BYTE “b” WRITE REGISTER BWb# BYTE “a” WRITE REGISTER BWa# BWE# GW# ENABLE CE# REGISTER CE2 CE2# OE# 16 SA0, SA1, SA MODE ADV# CLK ADSC# ADSP# BYTE “d” ...
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GENERAL DESCRIPTION (continued) Address and write control are registered on-chip to simplify WRITE cycles. This allows self-timed WRITE cycles. Individual byte enables allow individual bytes to be written. During WRITE cycles on the x18 device, BWa# controls DQa pins and ...
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ADV# 83 ADSP# 84 ADSC# 85 OE# 86 BWE# 87 GW# 88 CLK CE2# 92 BWa# 93 BWb CE2 97 CE ...
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TQFP PIN DESCRIPTIONS x18 x32/x36 SYMBOL 32-35, 44-49, 32-35, 44-49, 80-82, 99, 81, 82, 99, 100 100 93 93 BWa BWb# – 95 BWc# – 96 BWd BWE GW# 89 ...
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TQFP PIN DESCRIPTIONS (continued) x18 x32/x36 SYMBOL 85 85 ADSC MODE 64 64 (a) 58, 59, (a) 52, 53, 62, 63, 68, 69, 56-59, 62, 63 72 12, (b) 68, 69, 13, 18, 19, ...
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INTERLEAVED BURST ADDRESS TABLE (MODE = NC OR HIGH) FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) X...X00 X...X01 X...X10 X...X11 LINEAR BURST ADDRESS TABLE (MODE = LOW) FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) X...X00 X...X01 X...X10 X...X11 PARTIAL TRUTH TABLE FOR ...
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TRUTH TABLE OPERATION ADDRESS CE# CE2# CE2 ZZ Deselected Cycle, Power-Down Deselected Cycle, Power-Down Deselected Cycle, Power-Down Deselected Cycle, Power-Down Deselected Cycle, Power-Down SNOOZE MODE, Power-Down READ Cycle, Begin Burst READ Cycle, Begin Burst WRITE Cycle, Begin Burst READ Cycle, ...
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ABSOLUTE MAXIMUM RATINGS* Voltage on V Supply DD Relative to V .................................... -0.5V to +4.6V SS Voltage Supply DD Relative to V .................................... -0.5V to +4. ............................................... -0. Storage Temperature (plastic) ............ ...
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I OPERATING CONDITIONS AND MAXIMUM LIMITS DD (Note: 1) (0°C ≤ T ≤ +70° DESCRIPTION Device selected; All inputs ≤ V Power Supply Cycle time ≥ Current: Operating V = MAX; Outputs open DD Power Supply Device ...
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TQFP CAPACITANCE DESCRIPTION Control Input Capacitance Input/Output Capacitance (DQ) Address Capacitance Clock Capacitance TQFP THERMAL RESISTANCE DESCRIPTION Thermal Resistance Test conditions follow standard test methods (Junction to Ambient) Thermal Resistance (Junction to Top of Case) NOTE: 1. This parameter is ...
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ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS (Note 1) (0°C ≤ T ≤ +70° +3.3V +0.3V/-0.165V DESCRIPTION Clock Clock cycle time Clock frequency Clock HIGH time Clock LOW time Output Times Clock to output valid Clock ...
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I/O AC TEST CONDITIONS Input pulse levels ................. V .................... V Input rise and fall times ..................................... 1ns Input timing reference levels ..................... V Output reference levels ............................ V Output load ............................. See Figures 1 and 2 3.3V I/O ...
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SNOOZE MODE SNOOZE MODE is a low-current, “power-down” mode in which the device is deselected and current is reduced The duration of SNOOZE MODE dictated by the length of time the ZZ pin ...
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KC CLK ADSS t ADSH ADSP# ADSC ADDRESS BWE#, GW#, BWa#-BWd# t CES t CEH CE# (NOTE 2) ADV# OE# t OEQ t KQLZ Q ...
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KC CLK ADSS t ADSH ADSP# t ADSS t ADSH ADSC ADDRESS BYTE WRITE signals are ignored when ADSP# is LOW. BWE#, BWa#-BWd# GW# t CES t CEH CE# ...
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KC CLK ADSS t ADSH ADSP# ADSC ADDRESS BWE#, BWa#-BWd# t CES t CEH (NOTE 4) CE# (NOTE 2) ADV# OE# D High-Z Q Q(A1) Q(A2) Back-to-Back READs ...
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PIN #1 ID 14.00 ±0.10 +0.20 16.00 -0.05 NOTE: 1. All dimensions in millimeters MAX or typical here noted. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side. 8000 S. Federal Way, ...
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REVISION HISTORY Removed 165-pin FBGA package, Rev. 6/01 .................................................................................................. June/7/01 Removed FBGA Part Marking Guide, REV 8/00, FINAL ........................................................................ August/22/00 Changed FBGA capacitance values, REV 8/00, FINAL ............................................................................. August/7/ TYP 2.5pF from 4pF; MAX. 3.5pF from 5pF I ...
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KC CLK ADSS t ADSH ADSP# t ADSS t ADSH ADSC ADDRESS BYTE WRITE signals are ignored when ADSP# is LOW. BWE#, BWa#-BWd# GW# t CES t CEH CE# ...
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KC CLK ADSS t ADSH ADSP# ADSC ADDRESS BWE#, BWa#-BWd# t CES t CEH (NOTE 4) CE# (NOTE 2) ADV# OE# D High-Z Q Q(A1) Q(A2) Back-to-Back READs ...
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BALL A11 165X Ø 0.45 7.50 ±0.05 15.00 ±0.10 7.00 ±0.05 5.00 ±0.05 13.00 ±0.10 NOTE: 1. All dimensions in millimeters MAX or typical where noted. 2. Package width and length do not include mold protrusion; allowable ...
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PIN #1 ID 14.00 ±0.10 +0.20 16.00 -0.05 NOTE: 1. All dimensions in millimeters MAX or typical here noted. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side. 8000 S. Federal Way, ...
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REVISION HISTORY Removed FBGA Part Marking Guide, REV 8/00, FINAL ........................................................................ August/22/00 Changed FBGA capacitance values, REV 8/00, FINAL ............................................................................. August/7/ TYP 2.5pF from 4pF; MAX. 3.5pF from 5pF TYP 4pF from 6pF; MAX. 5pF ...