JC050H1 Lineage Power, JC050H1 Datasheet - Page 14

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JC050H1

Manufacturer Part Number
JC050H1
Description
Manufacturer
Lineage Power
Datasheet
dc-dc Converters; 18 to 36 Vdc Input, 24 Vdc Output; 50 W to 100 W
Thermal Considerations
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (θcs) and
sink-to-ambient (θsa) shown below (Title 26).
Figure 26. Resistance from Case-to-Sink and
14
14
P
D
Sink-to-Ambient
T
C
θcs
T
S
(continued)
θsa
T
A
8-1304
For a managed interface using thermal grease or foils,
a value of θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts.
θ
sa
=
(
------------------------ -
T
C
P
D
T
A
)
θ
cs
Lineage Power
March 2008

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