AC16FGM Teccor Electronics, AC16FGM Datasheet - Page 152

• Manufacturer Part Number: AC16FGM
• Manufacturer: Teccor Electronics

AN1005
Gluing Recommendations
Prior to wave soldering, surface mount devices (SMDs) must be
fixed to the PCB or substrate by means of an appropriate adhe-
sive. The adhesive (in most cases a multicomponent adhesive)
has to fulfill the following demands:
•
•
•
Low-temperature Solder for Reducing
PC Board Damage
In testing and troubleshooting surface-mounted components,
changing parts can be time consuming. Moreover, desoldering
and soldering cycles can loosen and damage circuit-board pads.
Use low-temperature solder to minimize damage to the PC board
and to quickly remove a component. One low-temperature alloy
is indium-tin, in a 50/50 mixture. It melts between 118 °C and
125 °C, and tin-lead melts at 183 °C. If a component needs
replacement, holding the board upside down and heating the
area with a heat gun will cause the component to fall off. Per-
forming the operation quickly minimizes damage to the board and
component.
Proper surface preparation is necessary for the In-Sn alloy to wet
the surface of the copper. The copper must be clean, and you
must add flux to allow the alloy to flow freely.You can use rosin
dissolved in alcohol. Perform the following steps:
(1) Cut a small piece of solder and flow it onto one of the pads.
(2) Place the surface-mount component on the pad and melt the
Figure AN1005.8
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Uniform viscosity to ensure easy coating
No chemical reactions upon hardening in order not to deterio-
rate component and PC board
Straightforward exchange of components in case of repair
soldered pad to its pin while aligning the part. (This operation
places all the pins flat onto their pads.)
MT2 / Anode
MT2 / Anode
Dual Footprint for Compak Package
M
T
2
Gate
Gate
MT1
MT1 / Cathode
MT2 / Anode
Not
used
Gate
MT1 / Cathode
AN1005 - 4
or SOT-223
Footprint
for either
Footprint
SOT-223
Compak
Footprint
Compak
(3) Cut small pieces of the alloy solder and flow each piece onto
Indium-tin solder is available from ACI Alloys, San Jose, CA and
Indium Corporation of America, Utica, NY.
Multi-use Footprint
Package soldering footprints can be designed to accommodate
more than one package. Figure AN1005.8 shows a footprint
design for using both the Compak and an SOT-223. Using the
dual pad outline makes it possible to use more than one supplier
source.
Cleaning Recommendations
Using solvents for PC board or substrate cleaning is permitted
from approximately 70 °C to 80 °C.
The soldered parts should be cleaned with azeotrope solvent fol-
lowed by a solvent such as methol, ethyl, or isopropyl alcohol.
Ultrasonic cleaning of surface mount components on PCBs or
substrates is possible.
The following guidelines are recommended when using ultra-
sonic cleaning:
•
•
•
•
•
Cleaning of the parts is best accomplished using an ultrasonic
cleaner which has approximately 20 W of output per one liter of
solvent. Replace the solvent on a regular basis.
each of the other legs of the component.
Cleaning agent: Isopropanol
Bath temperature: approximately 30 °C
Duration of cleaning: MAX 30 seconds
Ultrasonic frequency: 40 kHz
Ultrasonic changing pressure: approximately 0.5 bar
Dimensions are in inches (and millimeters).
(3.8)
0.150
(2.8)
0.110
(2.0)
0.079
0.079
(2.0)
Dual Pad Outline
Pad Outline
0.019
(.48)
0.040
(1.0)
0.030
(.76)
0.079
(2.0)
(8.33)
0.328
(2.0)
0.079
0.079
(2.0)
(2.0)
0.079
.055
(1.4)
0.030
(.76)
0.040
(1.0)
©2002 Teccor Electronics
Thyristor Product Catalog
(1.5) TYP
0.059
(2.31)
0.091
Application Notes
TYP