TS4990EIKJT STMicroelectronics, TS4990EIKJT Datasheet - Page 25

• Manufacturer Part Number: TS4990EIKJT
• Description: IC AMP AUDIO PWR 1.2W 9FLIPCHIP
• Manufacturer: STMicroelectronics
• Type: Class ABr

Specifications of TS4990EIKJT

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 1.2W x 1 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Features: Depop, Differential Inputs, Standby, Thermal Protection
• Mounting Type: Surface Mount
• Package / Case: 9-FlipChip
• For Use With: 497-6383 - BOARD DEMO FOR TS4990
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TS4990
Figure 67. Package mechanical data for 9-bump flip-chip package
Figure 68. Daisy chain mechanical data
The daisy chain sample features two-by-two pin connections. The schematics in
illustrate the way pins connect to each other. This sample is used to test continuity on your
board. Your PCB needs to be designed the opposite way, so that pins that are unconnected
in the daisy chain sample, are connected on your PCB. If you do this, by simply connecting
an Ohmmeter between pin A1 and pin A3, the soldering process continuity can be tested.
0.5mm
0.5mm
1.60 mm
1.60 mm
0.5mm
0.5mm
2
2
1
1
3
3
∅ 0.25mm
∅ 0.25mm
600µm
600µm
A
A
1.60 mm
1.60 mm
100µm
100µm
1.6mm
1.6mm
B
B
■
■
■
■
■
■
■
■
■
Die size: 1.60 x 1.60 mm ±30µm
Die height (including bumps): 600µm
Bump diameter: 315µm ±50µm
Bump diameter before reflow: 300µm ±10µm
Bump height: 250µm ±40µm
Die height: 350µm ±20µm
Pitch: 500µm ±50µm
Coplanarity: 50µm max
* Back coating height: 100µm ±10µm
* Optional
C
C
1.6mm
1.6mm
Package information
Figure 68
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