TEA1093 NXP Semiconductors, TEA1093 Datasheet

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TEA1093

Manufacturer Part Number
TEA1093
Description
Manufacturer
NXP Semiconductors
Datasheet

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Product specification
Supersedes data of 1995 May 18
File under Integrated Circuits, IC03
DATA SHEET
TEA1093
Hands-free IC
INTEGRATED CIRCUITS
1996 Feb 09

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TEA1093 Summary of contents

Page 1

... DATA SHEET TEA1093 Hands-free IC Product specification Supersedes data of 1995 May 18 File under Integrated Circuits, IC03 INTEGRATED CIRCUITS 1996 Feb 09 ...

Page 2

... APPLICATIONS Line-powered telephone sets with hands-free/listening-in functions. GENERAL DESCRIPTION The TEA1093 is a bipolar circuit intended for use in line-powered telephone sets. In conjunction with a member of the TEA1060 family or PCA1070 transmission circuits, the device offers a hands-free function for line powered telephone sets. It incorporates a supply, a microphone channel, a loudspeaker channel and a duplex controller with signal and noise monitors on both channels ...

Page 3

... MIC R = 30.1 k GAT GAT (RMS); RIN GAR GAR V = 150 mV (RMS); RIN note 1 L SWR = 365 k 3 Product specification TEA1093 = LOW; MUTET = LOW; amb MIN. TYP. MAX. 7 140 3.35 3.6 3.85 = 3.6 V 400 550 sup 12.5 15 17.5 10 +10 15 ...

Page 4

... VOLTAGE VA STABILIZER GND 8 R GAT GAT 21 MOUT TEA106X MICGND 18 R IDT IDT 16 V ref SWT 14 C SWT R STAB STAB 13 VOICE LOGIC SWITCH R SWR SWR 12 2 RIN1 RIN2 3 R VOL VOL 11 VOLUME CONTROL MGD216 TEA1093 from TEA106X from TEA106X ...

Page 5

... Feb 09 handbook, halfpage DLC/MUTER 1 RIN1 2 RIN2 3 LSP2 4 GAR 5 LSP1 6 SREF 7 TEA1093 GND 8 SUP VOL 11 SWR 12 STAB 13 SWT 14 MGD217 Fig.2 Pin configuration. 5 Product specification TEA1093 28 TSEN 27 TENV 26 TNOI 25 RSEN 24 RENV 23 RNOI 22 MIC 21 GAT 20 MOUT 19 MUTET 18 MICGND IDT 15 VA ...

Page 6

... For more details on the TEA1060 family, please refer to “Data Handbook IC03” . The right side of Fig.3 shows a principle diagram of the TEA1093, a hands-free add-on circuit with a microphone amplifier, a loudspeaker amplifier and a duplex controller. As can be seen from Fig.3, a loop is formed via the ...

Page 7

... SUP SREF R = 100 SREF follows that mA. SUP LINE The TEA1093 stabilizes its own supply voltage of 3 The voltage on V can be adjusted by means external resistor handbook, full pagewidth I SUP I line R SREF 100 I CC ...

Page 8

... The TEA1093 has an asymmetrical microphone input MIC with an input resistance The gain of the input stage varies according to the mode of the TEA1093. In the transmit mode, the gain is at its maximum; in the receive mode its minimum and in the idle mode halfway between maximum and minimum ...

Page 9

... The gain of the input stage varies according to the mode of the TEA1093. In the receive mode, the gain is at its maximum; in the transmit mode its minimum and in the idle mode halfway between maximum and minimum ...

Page 10

... TEA1093 from malfunctioning. Only the gain of the loudspeaker amplifier is affected since it is considered to be the major power consuming part of the TEA1093. When the TEA1093 experiences a loss of current, the supply voltage V decreases. In this event, the gain of the ...

Page 11

... Fig.9 Signal and noise envelope waveforms. DUPLEX CONTROLLER LOGIC Fig.10 Decision logic. 11 Product specification MBG354 time 16 IDT (12) V ref (1) 14 SWT (11 MGD224 TEA1093 R IDT C SWT ...

Page 12

... This would cause the TEA1093 to go into the idle mode and the user of the set would hear the dial tone fade away. To prevent this, a dial tone detector is incorporated which, in standard ...

Page 13

... MGD225 volume, the switching range becomes 0 dB. MBG351 Rx mode R VOL ( ) 5700 3800 1900 0 0 1900 3800 5700 200 400 V SWT V IDT (mV) 13 Product specification and is adjustable between 0 and 52 dB 365 k which results in a switching range TEA1093 and SWR STAB ...

Page 14

... TEA1093 TEA1093T 1996 Feb 09 CONDITIONS , RIN1 and RIN2 BB BB see also Figs 13 and 14 see also Figs 13 and 14 amb PARAMETER 14 Product specification TEA1093 MIN. MAX. UNIT GND GND BB V ...

Page 15

... 1.45 W. amb tot ( 1.27 W. amb tot ( 1.09 W. amb tot ( 0.91 W. amb tot Fig.13 TEA1093 safe operating area. 1996 Feb 09 150 MGD226 handbook, halfpage I SUP (mA) 130 (1) (2) 110 ( SUP (V) (1) T ...

Page 16

... (RMS) SUP PD = HIGH PD = HIGH 4.5 V SUP PD = HIGH 3 Product specification = LOW; MUTET = LOW; amb MIN. TYP. MAX. 3.35 3.6 3. 3.2 BB 4.5 5.5 7.0 0.4 275 315 355 0.5 V 0.4 V 0.3 GND 1 2.5 5 400 550 TEA1093 UNIT 0 ...

Page 17

... MUTET = HIGH MUTET = HIGH between pins RIN1 or 17 RIN2 and GND between pins RIN1 34 and RIN2 (RMS) RIN 21.5 15 (RMS); RIN T = -25 to +75 C amb 17 Product specification TEA1093 TYP. MAX. UNIT 17.5 dB +10 dB 0.3 dB 0.3 dB 100 dBmp 0 0 ...

Page 18

... R = 374 k ; RIN GAR SUP jumps R = 374 k ; RIN GAR SUP R = 374 k ; GAR mA; t SUP jumps BB 18 Product specification MIN. TYP. 0.3 390 1.2 1.45 2.5 2.9 2.5 2.9 3.5 4.0 5.15 150 300 5 250 0 att 2.75 1 TEA1093 MAX. UNIT ...

Page 19

... I = 0.8 to 160 A RSEN 0.75 when sourced from both RSEN and TSEN; envelope detectors tracking; note 5 0.75 when sourced from both RSEN and TSEN; noise detectors tracking; note 5 19 Product specification TEA1093 TYP. MAX. UNIT 0 ...

Page 20

... Corresponds output power. 3. Corresponds output power. 4. Corresponds to 100 mW output power. 5. Corresponds tracking. 6. Corresponds to 4.3 dB noise/speech recognition level. 1996 Feb 09 CONDITIONS note 6 RIN RINDT note vtx vrx 20 Product specification TEA1093 MIN. TYP. MAX. 127 13 13 7.5 10 12.5 7 0.5 ...

Page 21

... F Fig.15 Test circuit. C SWT 220 nF R IDT R STAB R SWR 2.2 M 3.65 k 365 IDT STAB SWR SWT TEA1093 MIC 4 LSP2 5 GAR 6 LSP1 TSEN TENV TNOI DLC/MUTER VOL TSEN R VOL DLC C TSEN C TENV C TNOI ...

Page 22

... C STAB 4 SWT from 220 nF microcontroller R IDT 2 SUP MUTET PD SREF IDT SWT 20 MOUT 21 GAT 2 RIN1 TEA1093 3 RIN2 18 MICGND 8 GND RSEN RENV RNOI TSEN TENV TNOI TSEN R RSEN RENV C RNOI C TENV C TNOI C TSEN ...

Page 23

... QR DTMF 100 nF C RIN2 100 SLPE Fig.17 Application proposal. C STAB 4.7 nF from microcontroller SREF SUP MUTET PD C VBB 470 F MOUT C MIC R MIC 22 MIC 100 nF TEA1093 2 RIN1 3 RIN2 MICGND 8 6 GND LSP1 C LSP1 LSP 50 MGD230 ...

Page 24

... 1.7 0.53 0.32 36.0 14.1 1.3 0.38 0.23 35.0 13.7 0.066 0.020 0.013 1.41 0.56 0.051 0.014 0.009 1.34 0.54 REFERENCES JEDEC EIAJ MO-015AH 24 Product specification 3.9 15.80 17.15 2.54 15.24 3.4 15.24 15.90 0.15 0.62 0.68 0.10 0.60 0.13 0.60 0.63 EUROPEAN PROJECTION TEA1093 SOT117 ( max. 0.25 1.7 0.01 0.067 ISSUE DATE 92-11-17 95-01-14 ...

Page 25

... EIAJ MS-013AE detail 10.65 1.1 1.1 0.25 0.25 1.4 10.00 0.4 1.0 0.419 0.043 0.043 0.055 0.01 0.01 0.394 0.016 0.039 EUROPEAN PROJECTION Product specification TEA1093 SOT136 ( 0.9 0.1 0 0.035 0.004 0.016 ISSUE DATE 95-01-24 97-05-22 ...

Page 26

... C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping extra thick tin/lead plating before package placement. 26 Product specification TEA1093 - BY HAND HELD SOLDERING ) ...

Page 27

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Feb 09 27 Product specification TEA1093 ...

Page 28

Philips Semiconductors – a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, ...

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