TDA8002C NXP Semiconductors, TDA8002C Datasheet
TDA8002C
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TDA8002C Summary of contents
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... DATA SHEET TDA8002C IC card interface Product specification Supersedes data of 1999 Feb 24 File under Integrated Circuits, IC02 INTEGRATED CIRCUITS 1999 Oct 12 ...
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... ISO 7816, GSM11.11 compatibility and EMV (Europay, MasterCard and Visa) compliant Step-up converter for V generation CC Supply supervisor for spikes elimination and emergency deactivation Chip select input for easy use of several TDA8002Cs in parallel. ORDERING INFORMATION TYPE NUMBER MARKING TDA8002CT/A/C1 TDA8002CT/A TDA8002CT/B/C1 TDA8002CT/B ...
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... CC I < 55 mA; DC load nAs; AC load CC active mode for < 55 mA; DC load nAs; AC load +85 C amb +85 C amb 3 Product specification TDA8002C MIN. TYP. MAX. UNIT 3.0 6.5 V 150 140 140 mA 4 ...
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... DGND2 DGND1 Fig.1 Block diagram. 4 470 AGND 11 2.5 MHz VUP 15 CLKUP EN2 GENERATOR EN5 22 RST BUFFER EN4 21 CLOCK BUFFER 18 20 I/O TRANSCEIVER 17 I/O TRANSCEIVER 16 I/O TRANSCEIVER FCE246 Product specification TDA8002C 470 100 100 nF nF RST CLK PRES AUX1 AUX2 I/O ...
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... Table card reset output (C2I supply for card (C1I start activation sequence input from microcontroller (active LOW card reset input from microcontroller 26 O open-drain NMOS interrupt output to microcontroller (active LOW) 5 Product specification TDA8002C DESCRIPTION ...
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... XTAL2 OFF 2 27 I/OUC 3 26 RSTIN AUX1UC CMDVCC ALARM 6 23 RST CLKSEL CLK 7 22 TDA8002CT/B CLKDIV1 8 21 AUX1 CLKDIV2 9 20 PRES STROBE PRES 10 19 CLKOUT I DGND1 12 VUP 17 AGND DDA FCE248 Fig.3 Pin configuration (TDA8002CT/B). ...
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... CLKDIV2 9 STROBE 10 CLKOUT 11 DGND1 12 AGND FCE249 Fig.4 Pin configuration (TDA8002CT/C). Fig.4 Pin configuration (TDA8002CT/C TDA8002CG Fig.5 Pin configuration (TDA8002CG). 7 Product specification TDA8002C MODE 28 OFF 27 26 RSTIN CMDVCC RST CLK 22 21 AUX1 20 CV/TV PRES 19 I/O 18 ...
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... The ALARM output is active until this delay has expired. When V falls below V DD and a deactivation sequence of the contacts is performed. 1999 Oct 12 Clock circuitry The TDA8002C supports both synchronous and asynchronous cards. There are three methods to clock the , V , AGND, DDA DDD circuitry: (i ...
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... Fig.6 ALARM as a function of V handbook, full pagewidth CS OFF, I/OUC AUX1UC, AUX2UC CS INPUTS 1999 Oct pulse width minimum Fig.7 Chip select. 9 Product specification TDA8002C V th2 V hys2 V th2 FCE272 t DZ FCE245 ...
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... When CS is HIGH, I/OUC, AUX1UC and AUX2UC are internally pulled- LOW, I/OUC, AUX1UC and AUX2UC are permanently HIGH (with integrated 100 k pull-up resistors connected Fig.8 Master and slave signals. 10 Product specification TDA8002C FREQUENCY OF FREQUENCY OF CLK int 1 ...
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... OFF output remain functional Internal oscillator is slowed to 32 kHz, providing 16 kHz on CLKOUT. A CTIVE MODE When the activation sequence is completed, the TDA8002C will be in the active mode. Data is exchanged between the card and the microcontroller via the I/O lines. ACTIVATION POWER OFF IDLE ...
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... LOW Product specification rises from 4T); I/O, AUX1 and AUX2 were forced LOW 7T); after must be selected by the level TDA8002C (according RSTIN has no 5 FCE273 ...
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... Fig.11 Activation sequence using CMDVCC, CLKDIV1 and CLKDIV2 signals to enable CLK. handbook, full pagewidth CMDVCC V CC I/O AUX1UC AUX1 RSTIN t act RST STROBE CLK Fig.12 Activation sequence for synchronous application. 1999 Oct 12 t act LOW 13 Product specification TDA8002C FCE274 FCE251 ...
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... CLK is stopped (t 3. I/O, AUX1 and AUX2 fall to zero ( falls to zero (t CC ensures that I/O remains below V slope VUP falls ( LOW Fig.13 Deactivation sequence 14 Product specification TDA8002C ...
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... OFF is set to HIGH state CC when the microcontroller has reset the CMDVCC line HIGH (after completion of the deactivation sequence). In the event that the card is not present OFF remains LOW LOW Fig.14 Emergency deactivation sequence. 15 Product specification TDA8002C t de FCE480 ...
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... Method 3015 (HBM 1500 , 100 pF) 3 positive pulses and 3 negative pulses on each pin with respect to ground. THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to ambient th(j-a) SOT136-1 SOT401-1 1999 Oct 12 CONDITIONS +85 C amb +85 C amb PARAMETER 16 Product specification TDA8002C MIN. MAX. 0.3 +6.5 0.3 +6.5 0.3 +6.5 0.3 +6 +125 0.56 0.46 25 ...
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... CC DC load nAs; AC load < load nAs; AC load from CC(O) V short-circuited to ground CC rising or falling slope note 1 note 2 17 Product specification TDA8002C MIN. TYP. MAX. 3 6.5 150 140 8 50 140 2.2 2.4 50 100 150 0.3 4.6 5.4 4.6 5.4 2.76 3 ...
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... Idle and low-power modes I 0 AUX2UC ( 20 - WITH K PULL UP RESISTOR CONNECTED I/OUC OH(OFF) 18 Product specification TDA8002C MIN. TYP. MAX. 1 0.5 200 0.3 0. 0.4 0. 0.5 0 600 HIGH ...
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... RST enabled I = 200 200 inactive modes I = 200 pF; note pF; note Product specification TDA8002C MIN. TYP. MAX. 0 0 0.3 ...
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... NTEGRATED K PULL UP RESISTOR CONNECTED guaranteed by design; see Fig.12 guaranteed by design; see Fig.14 see Figs 10 and 11 see Fig.11 pull-up resistor at pin OFF = device 2 devices in parallel 20 Product specification TDA8002C MIN. TYP. MAX note 0. 0. ...
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... CLKOUT transition time and duty cycle do not need to be tested. 5. PRES and CMDVCC are active LOW; RSTIN, PRES and CS are active HIGH. handbook, full pagewidth 1999 Oct 90% 90% 10% 10 Fig.15 Definition of transition times. 21 Product specification TDA8002C -------------- - 1 MGE741 ...
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... K2 (5) C6 470 nF (3) ( 100 nF 470 nF TDA8002C should be placed as close as possible to the card reader. (1) Contact normally open. (2) C3 close to pin V of TDA8002C. CC (3) C4 close to C1 contact of card reader. (4) C5 close to VUP pin of TDA8002C. ( close as possible to pins S1 and S2 14.745 ...
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... C4I CARD READ ( (3) C4 100 nF TDA8002C should be placed as close as possible to the card reader. (1) Contact normally open. (2) C3 close to pin V of TDA8002C. CC (3) C4 close to C1 contact of card reader. (4) C5 close to VUP pin of TDA8002C. ( close as possible to pins S1 and S2. Fig.17 Application diagram (for more details, see “Application note AN98054” ). ...
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... EIAJ MS-013AE detail 10.65 1.1 1.1 0.25 0.25 1.4 10.00 0.4 1.0 0.419 0.043 0.043 0.055 0.01 0.01 0.394 0.016 0.039 EUROPEAN PROJECTION Product specification TDA8002C SOT136 ( 0.9 0.1 0 0.035 0.004 0.016 ISSUE DATE 95-01-24 97-05-22 ...
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... 2.5 scale (1) ( 0.27 0.18 5.1 5.1 7.15 0.5 0.17 0.12 4.9 4.9 6.85 REFERENCES JEDEC EIAJ detail 7.15 0.75 1.0 0.2 0.12 0.1 6.85 0.45 EUROPEAN PROJECTION Product specification TDA8002C SOT401 (1) ( 0.95 0. 0.55 0.55 0 ISSUE DATE 95-12-19 97-08-04 ...
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... Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 C. 26 Product specification TDA8002C ...
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... Philips for any damages resulting from such improper use or sale. 1999 Oct 12 SOLDERING METHOD WAVE not suitable (2) not suitable suitable (3)(4) not recommended (5) not recommended 27 Product specification TDA8002C (1) REFLOW suitable suitable suitable suitable suitable ...
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Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...