UPD75P068CU NEC, UPD75P068CU Datasheet

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UPD75P068CU

Manufacturer Part Number
UPD75P068CU
Description
4-bit single-chip microcomputer incorporating 8K x 8bit
Manufacturer
NEC
Datasheet

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Document No. IC-3290A
Date Published April 1994 P
Printed in Japan
(O.D. No. IC-8623A
in which data can be written once.
before designing an application system.
FEATURES
ORDERING INFORMATION
The PD75P068 is produced by replacing the internal mask ROM of the PD75068 with a one-time PROM
The following user's manual describes the details of the functions of the PD75P068. Be sure to read it
Compatible with the PD75068
• Can be replaced with the PD75068 containing mask ROM on a full-production basis.
Internal one-time PROM: 8064 words
Internal RAM: 512 words
Internal pull-up resistors can be specified with software: Ports 0 to 3 and 6
N-ch open-drain input-output: Ports 4 and 5
Can operate at low voltage: V
Caution The PD75P068 is not provided with mask-selected pull-up resistors.
Please refer to "Quality Grades on NEC Semiconductor Devices" (Document number IEI-1209) published by NEC
Corporation to know the specification of quality grade on the devices and its recommended applications.
PD75068 User's Manual: IEU-1366
PD75P068CU
PD75P068GB-3B4
Part number
Major changes in this revision are indicated by stars ( ) in the margins.
4 BIT SINGLE-CHIP MICROCOMPUTER
The information in this document is subject to change without notice.
4 bits
DD
= 2.7 to 6.0 V
42-pin plastic shrink DIP (600 mil)
44-pin plastic QFP (Square 10 mm)
8 bits
DATA SHEET
Package
MOS INTEGRATED CIRCUIT
PD75P068
Quality grade
Standard
Standard
©
NEC CORPORATION 1993
1990

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UPD75P068CU Summary of contents

Page 1

... PD75P068CU PD75P068GB-3B4 Caution The PD75P068 is not provided with mask-selected pull-up resistors. Please refer to "Quality Grades on NEC Semiconductor Devices" (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-3290A Major changes in this revision are indicated by stars ( ) in the margins. ...

Page 2

PIN CONFIGURATION (TOP VIEW) • 42-pin plastic shrink DIP XT1 XT2 RESET X1 X2 MD3/P33 MD2/P32 MD1/P31 MD0/P30 AV SS AN7/KR3/P63 AN6/KR2/P62 AN5/KR1/P61 AN4/KR0/P60 AN3/P113 AN2/P112 AN1/P111 AN0/P110 AV REF • 44-pin plastic QFP 44 43 ...

Page 3

Basic interval timer INTBT Program TI0/P13 Timer/ counter (13) counter #0 PTO0/P20 INTT0 SI/SB1/P03 Serial SO/SB0/P02 interface SCK/P01 INTCSI INT0/P10 INT1/P11 Interrupt INT2/P12 control INT4/P00 PROM program KR0-KR3/P60-P63 4 memory 8064 8 bits BUZ/P23 Watch timer INTW AV REF AV ...

Page 4

PIN FUNCTIONS ........................................................................................................................ 1.1 PORT PINS .......................................................................................................................................... 1.2 NON-PORT PINS ................................................................................................................................ 1.3 PIN INPUT/OUTPUT CIRCUITS ........................................................................................................ 2. DIFFERENCE BETWEEN THE PD75P068 AND PD75068 ................................................... 3. WRITING TO AND VERIFYING PROM (PROGRAM MEMORY) ............................................ 3.1 OPERATING MODES WHEN WRITING TO ...

Page 5

PIN FUNCTIONS 1.1 PORT PINS Input/ Pin Shared pin output P00 Input INT4 I/O P01 SCK P02 I/O SO/SB0 P03 I/O SI/SB1 P10 INT0 P11 INT1 Input P12 INT2 P13 TI0 P20 PTO0 P21 — I/O P22 PCL P23 ...

Page 6

... DD V — — SS Notes 1. The circle ( ) indicates the Schmitt trigger input. 2. Unless the V pin is directly connected to the V PP PD75P068 does not operate normally. 6 Function Input for receiving external event pulse signal for timer/event counter Timer/event counter output Clock output Output for arbitrary frequency output (for buzzer ...

Page 7

PIN INPUT/OUTPUT CIRCUITS The input/output circuit of each PD75P068 pin is shown below in a simplified manner. Type A (For type E- P-ch IN N-ch CMOS input buffer Type B IN Schmitt trigger input with hysteresis Type ...

Page 8

Type F-A P.U.R. enable Data Type D Output disable Type B P.U.R.: Pull-up resistor Type F-B P.U.R. enable V DD Output disable (P) P-ch Data Output N-ch disable Output disable (N) P.U.R.: Pull-up resistor Type M-A Data N-ch (Withstand Output ...

Page 9

Type Y-D P.U.R. enable Data Type D Output disable Type B Type Y P.U.R.: Pull-up resistor 2. DIFFERENCE BETWEEN THE PD75P068 AND PD75068 The PD75P068 is produced by replacing the internal mask ROM (program memory) of the PD75068 with a ...

Page 10

... OPERATING MODES WHEN WRITING TO AND VERIFYING THE PROGRAM MEMORY applied to the V pin and +12 applied to the V DD write/verify mode. The specific operating mode is then selected by setting the MD0 through MD3 pins as listed below. The remaining pins are all connected to V Operating mode specification V V MD0 ...

Page 11

... WRITING TO THE PROGRAM MEMORY The procedure for writing to program memory is described below; high-speed write is possible. (1) Connect all unused pins (2) Apply and V pins (3) Wait 10 s. (4) Select program memory address clear mode. (5) Apply + and +12 (6) Select program inhibit mode. (7) Select write mode for 1 ms duration and write data. ...

Page 12

... READING THE PROGRAM MEMORY The procedure for reading the contents of program memory is described below. The read is performed in the verify mode. (1) Connect all unused pins to V through resistors. Apply a low-level signal to the X1 pin. SS (2) Apply and V pins (3) Wait 10 s. (4) Select program memory address clear mode. ...

Page 13

... It is recommended that you screen (verify) PROM products after writing necessary data into them and storing them at 125 C for 24 hours. NEC offers a charged service called QTOP microcomputer service. This service includes writing to one- time PROM, marking, screening, and verification. ...

Page 14

ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS (T a Parameter Symbol Supply voltage V DD Supply voltage V PP Input voltage V Ports other than ports 4 and 5 I1 Ports 4 and Output voltage ...

Page 15

CHARACTERISTICS OF THE MAIN SYSTEM CLOCK OSCILLATOR (T Recommended Resonator Parameter constant Ceramic Oscillator resonator frequency ( Oscillation settling time Note 2 Crystal Oscillator frequency ( ...

Page 16

CHARACTERISTICS OF THE SUBSYSTEM CLOCK OSCILLATOR (T Recommended Resonator Parameter constant Crystal Oscillator V XT1 XT2 SS frequency Oscillation settling time Note 2 XT1 input External frequency XT1 XT2 clock (f XT XT1 input high/low ...

Page 17

RECOMMENDED CAPACITORS IN THE OSCILLATION CIRCUIT Main system clock: Ceramic resonator (T Manufacturer Part number KBR-1000F/Y KBR-2.0MS PBRC 2.00A KBR-3.0MS KBR-3.58MSA PBRC 3.58A KBR-3.58MKS KBR-3.58MWS Kyocera KBR-4.00MSA PBRC 4.00A KBR-4.00MKS KBR-4.00MWS KBR-5.0MSA PBRC 5.00A KBR-5.0MKS KBR-5.0MWS CRHF2.50 CRHF4.19 Toko CRHT4.19 ...

Page 18

DC CHARACTERISTICS (T = - Parameter Symbol High-level V Ports 2, 3, and 11 IH1 input voltage V Ports 0, 1, and 6, and RESET IH2 V Ports 4 and 5 IH3 V X1, X2, ...

Page 19

... KR0 to KR3 RESET low level width t RSL Notes 1. The cycle time of the CPU clock ( ) depends on the connected resonator frequency, the system clock control register (SCC), and the processor clock control register (PCC). The figure on the right side shows the cycle time t ...

Page 20

SERIAL TRANSFER OPERATION Two-wire and three-wire serial I/O modes (SCK ... Internal clock output): Parameter Symbol SCK cycle time 4.5 to 6.0 V KCY1 DD SCK high/low level 4.5 to 6.0 V KL1 DD ...

Page 21

SBI mode (SCK ... Internal clock output (master)): Symbol Parameter t SCK cycle time V = 4.5 to 6.0 V KCY3 DD t SCK high/low level KL3 V = 4 width t KH3 t SB0/SB1 setup ...

Page 22

A/D CONVERTER (T = - Parameter Symbol Resolution Note 1 2.5 V Absolute accuracy Note 3 Conversion time t CONV Note 4 Sampling time t SAMP Reference input voltage AV REF Analog input voltage V ...

Page 23

AC Timing Measurement Points (Excluding X1 and XT1 Inputs) 0. lock Timing X1 input XT1 input TI0 Timing TI0 0.8V Measurement DD points 0. 0.4 V 1/f ...

Page 24

Serial Transfer Timing Three-wire serial I/O mode: SCK SI t KSO1 SO Two-wire serial I/O mode: SCK SB0 and SB1 t KSO2 24 t KCY1 t t KL1 KH1 t t SIK1 KSI1 Input data Output data t KCY2 t ...

Page 25

Serial Transfer Timing Bus release signal transfer: SCK t KSB SB0 and SB1 Command signal transfer: SCK t t KSB SB0 and SB1 Interrupt Input Timing INT0, INT1, INT2 and INT4 KR0-KR3 RESET Input Timing RESET t KCY3 t KCY4 ...

Page 26

DATA HOLD CHARACTERISTICS BY LOW SUPPLY VOLTAGE IN DATA MEMORY STOP MODE (T = - Parameter Symbol Data hold supply voltage V DDDR Note 1 I Data hold supply current DDDR t Release signal setting time ...

Page 27

CHARACTERISTIC CURVES (FOR REFERENCE (When the main system clock operates at 4.19 MHz with a crystal 5.0 Crystal 4.19 MHz 3 1.0 0.5 0.1 0.05 0.01 0.005 0.001 ...

Page 28

(When the main system clock operates at 2.0 MHz with a crystal 5.0 Crystal 2.0 MHz 3 1.0 0.5 0.1 0.05 0.01 0.005 0.001 XT1 XT2 ...

Page 29

(When the main system clock operates at 4.19 MHz with a ceramic resonator XT1 5.0 Ceramic Crystal resonator 32.768 kHz 4.19 MHz 3 1.0 0.5 0.1 0.05 ...

Page 30

(When the main system clock operates at 2.0 MHz with a ceramic resonator 5.0 Ceramic resonator 2.0 MHz 3 1.0 0.5 0.1 0.05 0.01 0.005 0.001 ...

Page 31

˚ PCC = 0011 2.5 2.0 PCC = 0010 1.5 1.0 PCC = 0000 Main system clock 0.5 HALT mode ...

Page 32

(Port 2 ...

Page 33

PACKAGE DRAWINGS 42PIN PLASTIC SHRINK DIP (600 mil NOTES 1) Each lead centerline is located within 0.17 mm (0.007 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to ...

Page 34

PIN PLASTIC QFP ( 10 NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition ...

Page 35

... Notice Other versions of the products are available. For these versions, the recommended reflow soldering conditions have been mitigated as follows: Higher peak temperature (235 C), two-stage, and longer exposure limit. Contact an NEC representative for details. 10 mm) Soldering conditions Soldering conditions PD75P068 ...

Page 36

... EP-75068CU-R Emulation probe for the PD75P068GB. A 44-pin conversion socket, the EV-9200G-64, is EP-75068GB-R attached to the probe. EV-9200G-44 PROM programmer PG-1500 PROM programmer adapter for the PD75P068CU/GB. Connected to the PG-1500. PA-75P008CU IE control program Host machine • PC-9800 series (MS-DOS PG-1500 controller TM • PC/AT ...

Page 37

... Package Manual SMD Surface Mount Technology Manual Quality Grades on NEC Semiconductor Devices NEC Semiconductor Device Reliability/Quality Control System Electrostatic Discharge (ESD) Test Guide to Quality Assurance for Semiconductor Devices Caution The above documents may be revised without notice. Use the latest versions when you design an application system ...

Page 38

PD75P068 ...

Page 39

... Strong static electricity may cause dielectric breakdown in gates. When transporting or storing MOS devices, use conductive trays, magazine cases, shock absorbers, or metal cases that NEC uses for packaging and shipping. Be sure to ground MOS devices during assembling. Do not allow MOS devices to stand on plastic plates or do not touch pins. ...

Page 40

... The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use “Standard” quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. ...

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