TDA8566TH/N2S,112 NXP Semiconductors, TDA8566TH/N2S,112 Datasheet
TDA8566TH/N2S,112
Specifications of TDA8566TH/N2S,112
Related parts for TDA8566TH/N2S,112
TDA8566TH/N2S,112 Summary of contents
Page 1
TDA8566 2 differential inputs and diagnostic outputs Rev. 06 — 15 October 2007 1. General description The TDA8566 is an integrated class-B output amplifier which is available in several packages. TDA8566TH is contained in a 20-lead small outline plastic package. ...
Page 2
... NXP Semiconductors 3. Quick reference data Table 14 specified. Symbol Parameter ORM stb SVRR cs CMRR n(o) [1] The circuit is DC adjusted at V [2] V ripple [3] Common mode rejection ratio measured at the output (over R V common [4] Noise measured in a bandwidth kHz. 4. Ordering information Table 2. Ordering information ...
Page 3
... NXP Semiconductors 5. Block diagram IN1+ IN1 n.c. V ref SGND IN2+ IN2 (1) HEATTAB PGND2 (1) Pin HEATTAB is available in TDA8566TH1 only. Fig 1. Block diagram TDA8566_6 Product data sheet 2 mute switch V A 2.3 k mute switch 2 standby switch standby V reference A voltage 1 mute reference 60 60 voltage k k mute ...
Page 4
... NXP Semiconductors 6. Pinning information 6.1 Pinning 20 MODE OUT2 18 17 PGND2 OUT2+ 16 TDA8566TH OUT1 15 PGND1 14 13 OUT1 CLIP 11 Fig 2. Pin configuration TDA8566TH Fig 4. Pin configuration TDA8566Q TDA8566_6 Product data sheet 2 40 W/2 HEATTAB 1 DIAG 2 IN2+ 3 IN2 4 n.c. 5 n.c. 6 n.c. 7 n.c. ...
Page 5
... NXP Semiconductors 6.2 Pin description Table 3. Symbol DIAG IN2+ IN2 n.c. n.c. n.c. n.c. n.c. n.c. IN1+ IN1 SGND CLIP V P1 n.c. OUT1+ PGND1 OUT1 n.c. OUT2+ PGND2 OUT2 n. MODE HEATTAB Table 4. Symbol IN1+ IN1 SGND CLIP V P1 OUT1+ PGND1 OUT1 n ...
Page 6
... NXP Semiconductors Table 4. Symbol OUT2+ PGND2 OUT2 V P2 MODE DIAG IN2+ IN2 7. Functional description The TDA8566 contains 2 identical amplifiers and can be used for BTL applications. The gain of each amplifier is fixed at 26 dB. Special features of this device are: • Mode select switch • ...
Page 7
... NXP Semiconductors Fig 5. Clip detection waveforms 7.3 Short-circuit diagnostic (pin DIAG) When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the output stages are switched off until the short-circuit is removed and the device is switched on again (with a delay of approximately 20 ms after the removal of the short-circuit). ...
Page 8
... NXP Semiconductors 7.6 Differential inputs The input stage is a high-impedance fully differential balanced input stage that is also capable of operating in a single-ended mode with one of the inputs capacitively coupled to an audio ground. It should be noted that if a source resistance is added (input voltage dividers) the CMRR degrades to lower values. ...
Page 9
... NXP Semiconductors 10. Static characteristics Table 14 Symbol Supply Operating condition V MODE I MODE Mute condition V MODE Standby condition V MODE I stb Diagnostic V DIAG [1] The circuit is DC adjusted TDA8566_6 Product data sheet 2 Static characteristics = 25 C; measured in test circuit of amb Parameter Conditions supply voltage quiescent current ...
Page 10
... NXP Semiconductors 11. Dynamic characteristics Table 14 otherwise specified. Symbol P o THD B f ro(l) f ro( SVRR n( TDA8566_6 Product data sheet 2 40 W/2 Dynamic characteristics = kHz; measured in test circuit of amb L i Parameter Conditions output power THD = 0.5 % THD = 10 % THD = 13.5 V; THD = 0 13.5 V; THD = THD = 0.5 % ...
Page 11
... NXP Semiconductors Table 14 otherwise specified. Symbol V o(mute) CMRR [1] Dynamic distortion detector active; pin CLIP is LOW. [2] Frequency response externally fixed. [3] V ripple [4] Noise measured in a bandwidth kHz. [5] Common mode rejection ratio measured at the output (over R V common [6] Common mode rejection ratio measured at the output (over R ...
Page 12
... NXP Semiconductors 13. Test information V MODE 220 in1 220 220 in2 220 Fig 9. Stereo BTL test diagram TDA8566_6 Product data sheet MODE P1 IN1 TDA8566 60 k IN1 CLIP V DETECTOR ref SGND DIAGNOSTIC INTERFACE IN2 IN2 PGND1 Rev. 06 — 15 October 2007 TDA8566 40 W/2 stereo BTL car radio power amplifier ...
Page 13
... NXP Semiconductors 14. Package outline HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height pin 1 index DIMENSIONS (mm are the original dimensions) A (1) UNIT max. 0.08 0.53 3.5 mm 3.5 0.35 0.04 0.40 3.2 Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
Page 14
... NXP Semiconductors HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height pin 1 index DIMENSIONS (mm are the original dimensions) A (1) UNIT max. 0.08 0.53 3.5 mm 3.5 0.35 0.04 0.40 3.2 Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
Page 15
... NXP Semiconductors DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm DIMENSIONS (mm are the original dimensions) UNIT 17.0 4.6 0.75 0.48 24.0 mm 15.5 4.4 0.60 0.38 23.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT243-1 Fig 12 ...
Page 16
... NXP Semiconductors 15. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
Page 17
... NXP Semiconductors 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
Page 18
... NXP Semiconductors Fig 13. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . TDA8566_6 Product data sheet 2 maximum peak temperature = MSL limit, damage level temperature minimum peak temperature ...
Page 19
... Data sheet status 20071015 Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 9 “Thermal characteristics”: changed value of R • ...
Page 20
... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
Page 21
... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Functional description . . . . . . . . . . . . . . . . . . . 6 7.1 Mode select switch (pin MODE 7.2 Clip detection (pin CLIP 7.3 Short-circuit diagnostic (pin DIAG ...