TDA8922CTH/N1,118 NXP Semiconductors, TDA8922CTH/N1,118 Datasheet - Page 40

• Manufacturer Part Number: TDA8922CTH/N1,118
• Description: IC AMP AUDIO CLASS D 24HSOP
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8922CTH/N1,118

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 155W x 1 @ 8 Ohm; 75W x 2 @ 6 Ohm
• Voltage - Supply: ±12.5 V ~ 32.5 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Package / Case: 24-HSOP
• Operational Class: Class-D
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.02@8Ohm@1W%
• Single Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Dual
• Rail/rail I/o Type: No
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): ±12.5V
• Mounting: Surface Mount
• Pin Count: 24
• Package Type: HSOP
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS compliant by exemption
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free by exemption / RoHS compliant by exemption
• Other names: 935286885118

NXP Semiconductors
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.3.1
8.3.1.1
8.3.1.2
8.3.2
8.3.3
8.3.4
8.4
9
10
11
12
12.1
12.2
12.3
13
13.1
13.2
13.3
13.3.1
13.3.2
13.4
13.5
13.6
13.7
13.8
14
15
15.1
15.2
15.3
15.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal characteristics. . . . . . . . . . . . . . . . . . 13
Static characteristics. . . . . . . . . . . . . . . . . . . . 13
Dynamic characteristics . . . . . . . . . . . . . . . . . 14
Application information. . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 33
Soldering of SMD packages . . . . . . . . . . . . . . 35
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pulse-width modulation frequency . . . . . . . . . . 8
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal protection . . . . . . . . . . . . . . . . . . . . . . 8
Thermal FoldBack (TFB) . . . . . . . . . . . . . . . . . 8
OverTemperature Protection (OTP) . . . . . . . . . 9
OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
Window Protection (WP). . . . . . . . . . . . . . . . . 10
Supply voltage protection . . . . . . . . . . . . . . . . 11
Differential audio inputs . . . . . . . . . . . . . . . . . 11
Switching characteristics . . . . . . . . . . . . . . . . 14
Stereo SE configuration characteristics . . . . . 15
Mono BTL application characteristics . . . . . . . 16
Mono BTL application . . . . . . . . . . . . . . . . . . . 17
Pin MODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Estimating the output power . . . . . . . . . . . . . . 17
Single-Ended (SE) . . . . . . . . . . . . . . . . . . . . . 17
Bridge-Tied Load (BTL) . . . . . . . . . . . . . . . . . 18
External clock . . . . . . . . . . . . . . . . . . . . . . . . . 18
Heatsink requirements . . . . . . . . . . . . . . . . . . 18
Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 20
Application schematic . . . . . . . . . . . . . . . . . . . 21
Curves measured in reference design
(demonstration board) . . . . . . . . . . . . . . . . . . 23
Introduction to soldering . . . . . . . . . . . . . . . . . 35
Wave and reflow soldering . . . . . . . . . . . . . . . 35
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 35
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 36
16
16.1
16.2
16.3
16.4
17
18
18.1
18.2
18.3
18.4
19
20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Soldering of through-hole mount packages . 37
Revision history . . . . . . . . . . . . . . . . . . . . . . . 38
Legal information . . . . . . . . . . . . . . . . . . . . . . 39
Contact information . . . . . . . . . . . . . . . . . . . . 39
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . . 37
Soldering by dipping or by solder wave . . . . . 37
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 37
Package related soldering information . . . . . . 38
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 39
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2
75 W class-D power amplifier
TDA8922C
Date of release: 7 September 2009
Document identifier: TDA8922C_1
All rights reserved.