SI3225-BQ Silicon Laboratories Inc, SI3225-BQ Datasheet - Page 106
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SI3225-BQ
Manufacturer Part Number
SI3225-BQ
Description
IC SLIC/CODEC DUAL-CH 64TQFP
Manufacturer
Silicon Laboratories Inc
Series
ProSLIC®r
Specifications of SI3225-BQ
Package / Case
*
Function
Subscriber Line Interface Concept (SLIC), CODEC
Interface
GCI, PCM, SPI
Number Of Circuits
2
Voltage - Supply
3.3V, 5V
Current - Supply
65mA
Power (watts)
941mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Includes
Battery Switching, BORSCHT Functions, DTMF Generation and Decoding, FSK Tone Generation, Modem and Fax Tone Detection
Product
SLIC
Supply Voltage (min)
3.13 V
Supply Current
22 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Channels
2
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI3225-BQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Si3220/25 Si3200/02
106
Pin #(s)
epad
12
13
14
15
16
Symbol
IRINGN
IRINGP
THERM
ITIPN
ITIPP
GND
Output
Input/
O
I
I
I
I
Description
Negative RING Current Control.
Connect to the IRINGN lead of the Si3220 or Si3225.
Positive RING Current Drive.
Connect to the IRINGP lead of the Si3220 or Si3225.
Thermal Sensor.
Connect to THERM pin of Si3220 or Si3225.
Negative TIP Current Control.
Connect to the ITIPN lead of the Si3220 or Si3225.
Positive TIP Current Control.
Connect to the ITIPP lead of the Si3220 or Si3225.
Exposed Die Paddle Ground.
For adequate thermal management, the exposed die paddle should be sol-
dered to a PCB pad that is connected to low-impedance inner and/or back-
side ground planes using multiple vias. See “7. Package Outline: 16-Pin
ESOIC” for PCB pad dimensions.
Rev. 1.3