CPC1465MTR Clare, CPC1465MTR Datasheet - Page 15

• Manufacturer Part Number: CPC1465MTR
• Description: IC SHDSL/ISDN DC TERM 16-MLP
• Manufacturer: Clare

Specifications of CPC1465MTR

• Function: DC Signal Termination
• Interface: ISDN, SHDSL
• Number Of Circuits: 1
• Power (watts): 1W
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-DFN
• Includes: Optocoupler
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Voltage - Supply: -
• Lead Free Status / Rohs Status: Compliant
• Other names: CLA271TR

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Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
3.3.2 DFN
3.4 Soldering
3.4.1 Moisture Reflow Sensitivity
Clare has characterized the moisture reflow sensitivity
for this product using IPC/JEDEC standard
J-STD-020. Moisture uptake from atmospheric
humidity occurs by diffusion. During the solder reflow
process, in which the component is attached to the
PCB, the whole body of the component is exposed to
high process temperatures. The combination of
moisture uptake and high reflow soldering
temperatures may lead to moisture induced
delamination and cracking of the component. To
prevent this, this component must be handled in
accordance with IPC/JEDEC standard J-STD-033 per
the labeled moisture sensitivity level (MSL), level 1 for
the SOIC package, and level 3 for the DFN package.
R02
Embossed
Carrier
(13.00 Dia)
330.2 Dia
Tape Thickness
(0.004 Max)
0.102 Max
Top Cover
Embossment
(0.063 + 0.004)
K
0
=1.61 + 0.10
www.clare.com
www.clare.com
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
P=12.00 + 0.10
(0.472 + 0.004)
3.4.2 Reflow Profile
For proper assembly, this component must be
processed in accordance with the current revision of
IPC/JEDEC standard J-STD-020. Failure to follow the
recommended guidelines may cause permanent
damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
3.5 Washing
Clare does not recommend ultrasonic cleaning of this
part.
Pin 1
User Direction of Feed
Pb
(0.246 + 0.004)
A
0
=6.24 + 0.10
Specifications: DS-CPC1465 - R02
© Copyright 2008, Clare, Inc.
All rights reserved. Printed in USA.
4/16/08
2002/95/EC
RoHS
(0.285 + 0.004)
B
0
=7.24 + 0.10
W=16.00 + 0.30
(0.630 + 0.012)
e
3
Dimensions
(inches)
mm
15