CPC5622ATR Clare, CPC5622ATR Datasheet - Page 18

• Manufacturer Part Number: CPC5622ATR
• Description: LITELINK III PHONE LINE 32SOIC
• Manufacturer: Clare
• Series: LITELINK® IIIr

Specifications of CPC5622ATR

• Function: Data Access Arrangement (DAA)
• Number Of Circuits: 1
• Voltage - Supply: 3 V ~ 5.5 V
• Current - Supply: 9mA
• Power (watts): 1W
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-SOIC (7.5mm Width)
• Includes: CID Monitoring, Full-Wave Ring Detector, Half-Wave Ring Detector
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: SOIC
• Rad Hardened: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Interface: -
• Lead Free Status / Rohs Status: Compliant
• Other names: CLA322TR; CPC5622ATR

7.2 Tape and Reel Packaging
Figure 18.
7.3 Soldering
7.3.1 Moisture Reflow Sensitivity
Clare has characterized the moisture reflow sensitivity
of this package, and has determined that this
component must be handled in accordance with
IPC/JEDEC standard J-STD-033 moisture sensitivity
level (MSL), level 3 classification.
7.3.2 Reflow Profile
For proper assembly, the component must be
processed in accordance with the current revision of
IPC/JEDEC standard J-STD-020. Failure to follow the
recommended guidelines may cause permanent
damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
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Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Tape and Reel Packaging for 32-Pin SOIC Package
Embossed
Tape and Reel Dimensions
Carrier
(13.00 Dia)
330.2 Dia
Tape Thickness
(0.004 Max)
0.102 Max
Top Cover
Embossment
www.clare.com
Top Cover
(0.126
(0.106
K
K
Tape
0
1
=3.20
=2.70
±
±
0.006)
0.006)
±
±
0.15
0.15
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
7.4 Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
P=12.00
(0.472)
User Direction of Feed
Pb
Specification: DS-CPC5622 - R02
Copyright © 2008, Clare, Inc.
LITELINK
All rights reserved. Printed in USA.
10/10/08
®
2002/95/EC
is a registered trademark of Clare, Inc.
RoHS
B
(0.421
0
=10.70
A
(0.429
0
=10.90
e
±
0.006)
3
±
±
0.15
W=16.00
0.006)
(0.630
±
0.15
CPC5622
Dimensions
(inches)
±
mm
0.012)
±
0.30
18