M25P40-VMP6TGB Micron Technology Inc, M25P40-VMP6TGB Datasheet - Page 60

• Manufacturer Part Number: M25P40-VMP6TGB
• Manufacturer: Micron Technology Inc

Specifications of M25P40-VMP6TGB

• Cell Type: NOR
• Density: 4Mb
• Access Time (max): 8ns
• Interface Type: Serial (SPI)
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: MLP EP
• Program/erase Volt (typ): 2.3 to 3.6V
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 512K
• Supply Current: 8mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / Rohs Status: Compliant

Table 31.
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14-April-2010
14-May-2009
18-February-
23-Feb-2010
2009
Date
Document revision history (continued)
Revision
17
18
19
20
Revised the following:
– Table 8: Vwi Min (Grade 3) = 1V vs. 2.1V or (remove one row & Grade indication)
– Table 11: Erase/Program cycles = 100000 cycles also for Grade 3 (instead of
– Table 13: Icc3 Operating Current (READ) ' change on section Test Condition
– Table 14: Icc3 Operating Current (READ) ' change on section Test Condition
– Table 15: this is valid also for grade 3:
– Table 16: this is valid also for grade 3:
– Table 17: with last 2 previous modifications it is possible to remove it
– Table 19: Insert in heading:” identified with device belonging to X technology
Revised cross references in
Added the following package information:
–
–
Corrected package nomenclature.
10000)
OLD: C = 0.1VCC / 0.9.VCC at 40 MHz and 75 MHz, Q = open
NEW: C = 0.1VCC / 0.9.VCC at 40 MHz, 50 MHz and 75 MHz, Q = open
OLD: C = 0.1VCC / 0.9.VCC at 25 MHz, Q = open
NEW: C = 0.1VCC / 0.9.VCC at 25 MHz and 33 MHz, Q = open
OLD: C = 0.1VCC / 0.9.VCC at 25 MHz, Q = open
NEW: C = 0.1VCC / 0.9.VCC at 25 MHz and 75 MHz, Q = open
OLD: C = 0.1VCC / 0.9.VCC at 20 MHz, Q = open
NEW: C = 0.1VCC / 0.9.VCC at 20 MHz and 33 MHz, Q = open
OLD: Instruction times, process technology 110 nm (device grade 6)
NEW: Instruction times, process technology 110 nm
OLD: Instruction times, process technology 150 nm (device grade 6)
NEW: Instruction times, process technology 150 nm
version;” Change tRES1 = 30 us & tRES2 = 30us (remove 3 us & 1.8 us & note 5)
Figure 30.: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead,
4 x 3 mm package mechanical data
Figure 31.: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead,
2 x 3 mm package outline
Table 11.: Device grade and AC table
Changes
correlation.