M25P40-VMP6TGB Micron Technology Inc, M25P40-VMP6TGB Datasheet - Page 54

• Manufacturer Part Number: M25P40-VMP6TGB
• Manufacturer: Micron Technology Inc

Specifications of M25P40-VMP6TGB

• Cell Type: NOR
• Density: 4Mb
• Access Time (max): 8ns
• Interface Type: Serial (SPI)
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: MLP EP
• Program/erase Volt (typ): 2.3 to 3.6V
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 512K
• Supply Current: 8mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / Rohs Status: Compliant

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Figure 31. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead,
1. Drawing is not to scale.
Table 28.
1. Dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
Symbol
measuring.
ddd
b
D2
A1
E2
L1
L3
A
D
E
e
L
(1)
(2)
2 x 3 mm package outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead,
2 x 3 mm package mechanical data
A
0.55
0.02
0.25
2.00
1.60
3.00
0.20
0.50
0.45
Typ
E
—
—
—
A1
millimeters
D
0.45
0.00
0.20
1.90
1.50
2.90
0.10
0.40
0.30
Min
—
—
—
Max
0.60
0.05
0.30
2.10
1.70
0.08
3.10
0.30
0.50
0.15
ddd
—
—
L3
0.022
0.001
0.010
0.079
0.063
0.118
0.008
0.020
0.018
Typ
—
—
—
D2
e
b
inches
0.018
0.000
0.008
0.075
0.059
0.004
0.016
0.012
0.114
Min
UFDFPN-01
—
—
—
L1
E2
L
0.024
0.002
0.012
0.083
0.067
0.003
0.122
0.012
0.020
0.006
Max
—
—