STM8L151F3U6 STMicroelectronics, STM8L151F3U6 Datasheet - Page 9
![no-image](/images/manufacturer_photos/0/6/637/stmicroelectronics_sml.jpg)
STM8L151F3U6
Manufacturer Part Number
STM8L151F3U6
Description
MCU 8BIT 8KB FLASH 20-UFQFPN
Manufacturer
STMicroelectronics
Series
STM8L EnergyLiter
Datasheet
1.STM8L151G3U6.pdf
(110 pages)
Specifications of STM8L151F3U6
Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, IR, POR, PWM, WDT
Number Of I /o
18
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-UFQFN
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-11495-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM8L151F3U6
Manufacturer:
ST
Quantity:
2 000
Part Number:
STM8L151F3U6
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
STM8L151F3U6TR
Manufacturer:
TI
Quantity:
1 530
Company:
Part Number:
STM8L151F3U6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM8L151x2, STM8L151x3
1
Introduction
This document describes the features, pinout, mechanical data and ordering information for
the Low density STM8L15xxx devices: STM8L151x2 and STM8L151x3 microcontrollers
with a Flash memory density of up to 8 Kbytes.
For further details on the STMicroelectronics Ultralow power family please refer to
Section 2.2: Ultralow power continuum on page
For detailed information on device operation and registers, refer to the reference manual
(RM0031).
For information on to the Flash program memory and data EEPROM, refer to the
programming manual (PM0054).
For information on the debug module and SWIM (single wire interface module), refer to the
STM8 SWIM communication protocol and debug module user manual (UM0470).
For information on the STM8 core, refer to the STM8 CPU programming manual (PM0044).
Low density devices provide the following benefits:
●
●
●
●
Integrated system
–
–
–
–
–
Ultralow power consumption
–
–
–
Advanced features
–
–
Short development cycles
–
–
Up to 8 Kbytes of low-density embedded Flash program memory
256 bytes of data EEPROM
1 Kbyte of RAM
Internal high-speed and low-power low speed RC.
Embedded reset
1 µA in Active-halt mode
Clock gated system and optimized power management
Capability to execute from RAM for Low power wait mode and Low power run
mode
Up to 16 MIPS at 16 MHz CPU clock frequency
Direct memory access (DMA) for memory-to-memory or peripheral-to-memory
access.
Application scalability across a common family product architecture with
compatible pinout, memory map and modular peripherals.
Wide choice of development tools
Doc ID 018780 Rev 2
13.
Introduction
9/110