PIC18F1220-H/SO Microchip Technology, PIC18F1220-H/SO Datasheet - Page 291
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC18F1220-H/SO
Manufacturer Part Number
PIC18F1220-H/SO
Description
IC MCU 8BIT 4KB FLASH 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheet
1.PIC18F1220-ISO.pdf
(308 pages)
Specifications of PIC18F1220-H/SO
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
4KB (2K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 150°C
Package / Case
18-SOIC (0.295", 7.50mm Width)
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- Current page: 291 of 308
- Download datasheet (5Mb)
© 2007 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
A
NOTE 1
PAD
Units
D2
A1
A3
E2
N
A
E
D
K
e
b
L
E2
1
2
0.80
0.00
3.65
3.65
0.23
0.50
0.20
MIN
N
PIC18F1220/1320
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
D2
28
–
Microchip Technology Drawing C04-105B
MAX
1.00
0.05
4.20
0.35
0.70
4.20
–
L
DS39605F-page 289
b
K
e
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