LPC1777FBD208,551 NXP Semiconductors, LPC1777FBD208,551 Datasheet - Page 109
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
LPC1777FBD208,551
Manufacturer Part Number
LPC1777FBD208,551
Description
IC MCU 32BIT 512KB FLASH 208LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheet
1.LPC1774FBD208551.pdf
(117 pages)
Specifications of LPC1777FBD208,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, EBI/EMI, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
165
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-7570
LPC1777FBD208,551
LPC1777FBD208,551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1777FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
16. Soldering
LPC178X_7X
Objective data sheet
Fig 46. Reflow soldering of the LQFP208 package
Footprint information for reflow soldering of LQFP208 package
DIMENSIONS in mm
0.500
P1
0.560
P2
31.300 31.300 28.300 28.300
Hy
solder land
occupied area
Ax
Gy
Ay
C
Bx
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
0.280
Rev. 2 — 27 May 2011
Generic footprint pattern
D1
0.400 28.500 28.500 31.550 31.550
P1
D2
Gx
Hx
Bx
Ax
Gx
(0.125)
Gy
32-bit ARM Cortex-M3 microcontroller
Hx
D1
Hy
LPC178x/7x
By
© NXP B.V. 2011. All rights reserved.
Ay
sot459-1_fr
SOT459-1
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