LPC1774FBD208,551 NXP Semiconductors, LPC1774FBD208,551 Datasheet - Page 106
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
LPC1774FBD208,551
Manufacturer Part Number
LPC1774FBD208,551
Description
IC MCU 32BIT 128KB FLASH 208LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheet
1.LPC1774FBD208551.pdf
(117 pages)
Specifications of LPC1774FBD208,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, EBI/EMI, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
165
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-7567
LPC1774FBD208,551
LPC1774FBD208,551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1774FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
Fig 43. TFBGA208 package
LPC178X_7X
Objective data sheet
TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT950-1
VERSION
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
T
P
K
H
F
D
B
U
R
N
G
E
C
A
L
J
0.8
0.6
A
2
1
IEC
2
0.5
0.4
3
b
4
5
15.1
14.9
6
D
e
7
8
15.1
14.9
e
D
9
JEDEC
E
1
All information provided in this document is subject to legal disclaimers.
10
- - -
11
REFERENCES
12
0.8
e
13
0
14
12.8
Rev. 2 — 27 May 2011
15
e
b
1
16
17
12.8
JEITA
e
2
scale
5
B
e
0.15
∅ v
∅ w
v
e
A
E
M
M
2
0.08
C
C
w
A
10 mm
B
0.12
y
A
32-bit ARM Cortex-M3 microcontroller
0.1
y
A
1
2
A
1
y
1
PROJECTION
EUROPEAN
C
detail X
LPC178x/7x
C
X
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
06-06-01
06-06-14
SOT950-1
106 of 117
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