ISL23328TFVZ-TK Intersil, ISL23328TFVZ-TK Datasheet - Page 19

• Manufacturer Part Number: ISL23328TFVZ-TK
• Description: IC DGTL POT 2CH 100K 14TSSOP
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of ISL23328TFVZ-TK

• Taps: 128
• Resistance (ohms): 100K
• Number Of Circuits: 2
• Temperature Coefficient: 45 ppm/°C Typical
• Memory Type: Volatile
• Interface: I²C (Device Address)
• Voltage - Supply: 1.2 V ~ 5.5 V, 1.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: *
• Package / Case: *
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Package Outline Drawing
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
6.40
0.20 C B A
4.40 ±0.10
2
SEATING
PLANE
C
(0.65 TYP)
(5.65)
0.10 C
TYPICAL RECOMMENDED LAND PATTERN
3
H
14
1
19
5.00 ±0.10
SIDE VIEW
TOP VIEW
0.65
1
0.25 +0.05/-0.06
0.10
3
0.05
8
7
CBA
A
I.D. MARK
(0.35 TYP)
PIN #1
1.20 MAX
(1.45)
B
5
ISL23328
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
2. Dimension does not include interlead flash or protrusion. Interlead
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153, variation AB-1.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
flash or protrusion shall not exceed 0.25 per side.
shall be 0.80mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
0.90 +0.15/-0.10
0.15 MAX
0.05 MIN
DETAIL "X"
SEE
0.09-0.20
DETAIL "X"
END VIEW
1.00 REF
GAUGE
PLANE
0.60 ±0.15
0°-8°
August 19, 2011
0.25
FN7902.0