XC2VP70-7FF1517C Xilinx Inc, XC2VP70-7FF1517C Datasheet - Page 198

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XC2VP70-7FF1517C

Manufacturer Part Number
XC2VP70-7FF1517C
Description
FPGA Virtex-II Pro Family 74448 Cells 1350MHz 0.13um/90nm (CMOS) Technology 1.5V 1517-Pin FCBGA
Manufacturer
Xilinx Inc
Datasheet

Specifications of XC2VP70-7FF1517C

Package
1517FCBGA
Family Name
Virtex-II Pro
Device Logic Units
74448
Number Of Registers
66176
Maximum Internal Frequency
1350 MHz
Typical Operating Supply Voltage
1.5 V
Maximum Number Of User I/os
964
Ram Bits
6045696
Re-programmability Support
Yes

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R
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF672 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 4: FF672 Flip-Chip Fine-Pitch BGA Package Specifications
FF896 Flip-Chip Fine-Pitch BGA Package
As shown in
Table
9, XC2VP7, XC2VP20, and XC2VP30 Virtex-II Pro devices are available in the FF896 flip-chip fine-pitch
BGA package. Pins in each of these devices are the same, except for differences shown in the "No Connects" column.
Following this table are the
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
pitch).
www.xilinx.com
DS083 (v4.7) November 5, 2007
Module 4 of 4
Product Specification
70

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