PKL4316PIT Ericsson Power Modules, PKL4316PIT Datasheet - Page 2
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PKL4316PIT
Manufacturer Part Number
PKL4316PIT
Description
Module DC-DC 1-OUT 28V 11A 310W 11-Pin Half-Brick Tray
Manufacturer
Ericsson Power Modules
Type
Step Downr
Datasheet
1.PKL4110PITLA.pdf
(38 pages)
Specifications of PKL4316PIT
Package
11Half-Brick
Output Current
11 A
Output Voltage
28 V
Input Voltage
48/60 V
Number Of Outputs
1
Output Power
310 W
Switching Regulator
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PKL4316PIT
Manufacturer:
ERICSSON
Quantity:
292
Part Number:
PKL4316PIT
Quantity:
60
Company:
Part Number:
PKL4316PITM
Manufacturer:
ERICSSON
Quantity:
38
Company:
Part Number:
PKL4316PITM
Manufacturer:
ERICSSON
Quantity:
492
Part Number:
PKL4316PITM
Manufacturer:
ERICSSON/爱立信
Quantity:
20 000
Company:
Part Number:
PKL4316PITO
Manufacturer:
ERICSSON
Quantity:
38
Company:
Part Number:
PKL4316PITO
Manufacturer:
ERICSSON
Quantity:
726
Prepared (also subject responsible if other)
SEC/D Kevin Chen
Approved
PKL 4000 PI series
DC/DC converters, Input 36-75 V, Output 100 A/300 W
General Information
Ordering Information
See Contents for individual product ordering numbers.
Option
Positive Remote Control Logic
Lead length 3.69 mm (0.145 in)
Lead length 4.57 mm (0.180 in)
Lead length 2.80 mm (0.11 in)
Note: As an example a positive logic, short pin product would be
PKL 4118B PIPTLA
Reliability
The Mean Time Between Failure (MTBF) is calculated at full
output power and an operating ambient temperature (T
+40°C. Different methods could be used to calculate the
predicted MTBF and failure rate which may give different
results. Ericsson Power Modules currently uses two
different methods, Ericsson failure rate data system
DependTool and Telcordia SR332.
Predicted MTBF for the series is:
-
-
The Ericsson failure rate data system is based on field
tracking data. The data corresponds to actual failre rates of
components used in Information Technology and Telecom
(IT&T) equipment in temperature controlled environments
(T
standard method intended for reliability calculations in IT&T
equipment. The parts count procedure used in this method
was originally modelled on the methods from
MIL-HDBK-217F, Reliability Predictions of Electronic
Equipment.
It assumes that no reliability data is available on the actual
units and devices for which the predictions are to be made,
i.e. all predictions are based on generic reliability
parameters.
A
= -5...+65°C). Telcordia SR332 is a commonly used
2.2 million hours according to DependTool.
1.05 million hours according to TelCordia SR332,
issue 1, Black box technique.
Suffix
P
LA
LB
LC
PKL 4219A PIPT
PKL 4118B PITLA
PKL 4118B PITLB
PKL 4118B PITLC
Ordering No.
Checked
A
) of
PRODUCT SPECIFICATION
No.
1/1301-BMR632 Uen
Date
2007-1-11
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
-
-
-
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use to
boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose
(including, but not limited to, use in life support
applications, where malfunctions of product can cause
injury to a person’s health or life).
Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Technical Specifi cation
EN/LZT 146 311 R2E June 2007
© Ericsson Power Modules AB
Rev
D
Reference
2 (3)
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