ISL5216KI-1 Intersil, ISL5216KI-1 Datasheet - Page 64

• Manufacturer Part Number: ISL5216KI-1
• Description: Digital Down Converter 196-Pin BGA
• Manufacturer: Intersil

Specifications of ISL5216KI-1

• Package: 196BGA
• Operating Temperature: -40 to 85 °C

Plastic Ball Grid Array Packages (BGA)
o
V196.15x15 package information available on Intersil’s website.
V
A1 CORNER I.D.
A1 CORNER
0.006
0.003
0.15
0.08
A
C
S
M
M
b
A
C
C
A B
A1
A2
14
13
12 11 10 9
BOTTOM VIEW
S
64
SIDE VIEW
TOP VIEW
A
8
D1
D
7 6 5
4
3
SEATING PLANE
ALL ROWS AND COLUMNS
2
1
A
e
E
A
B
C
D
E
F
G
H
J
K
L
M
N
P
B
E1
bbb
A1
CORNER
A1
CORNER I.D.
aaa
C
ISL5216
C
V196.12x12
196 BALL PLASTIC BALL GRID ARRAY PACKAGE
NOTES:
SYMBOL
1. Controlling dimension: MILLIMETER. Converted inch
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the
6. Dimension “A” includes standoff height “A1”, package body
7. Dimension “b” is measured at the maximum ball diameter,
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
MD/ME
D1/E1
D/E
bbb
aaa
A1
A2
dimensions are not necessarily exact.
and “E” dimensions, respectively.
spherical crowns of the contact balls.
thickness and lid or cap height “A2”.
parallel to the primary datum C.
the position of the solder balls nearest to package
centerlines. When there is an even number of balls in the
outer row the value is “S” = e/2.
N
A
b
e
0.012
0.037
0.016
0.468
0.405
MIN
-
0.032 BSC
INCHES
14 x 14
0.004
0.005
196
0.016
0.044
0.020
0.413
MAX
0.059
0.476
11.90
10.30
0.31
0.93
0.41
MILLIMETERS
MIN
-
0.80 BSC
14 x 14
0.10
0.12
196
12.10
10.50
MAX
1.50
0.41
1.11
0.51
Rev. 2 12/00
July 13, 2007
NOTES
FN6013.3
7
3
-
-
-
-
-
-
-
-
-