H57V2562GTR-75C HYNIX SEMICONDUCTOR, H57V2562GTR-75C Datasheet - Page 20
H57V2562GTR-75C
Manufacturer Part Number
H57V2562GTR-75C
Description
58T1903
Manufacturer
HYNIX SEMICONDUCTOR
Datasheet
1.H57V2562GTR-75C.pdf
(23 pages)
Specifications of H57V2562GTR-75C
Memory Type
SDRAM
Memory Configuration
16M X 16
Access Time
6ns
Interface Type
LVTTL
Memory Case Style
TSOPII
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Memory Size
256 Mbit
Rohs Compliant
Yes
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Note :
1. H: Logic High, L: Logic Low, X: Don
2. All entries assume that CKE was active during the preceding clock cycle.
3. If both banks are idle and CKE is inactive, then in power down cycle
4. Illegal to bank in specified states. Function may be legal in the bank indicated by Bank Address,
5. If both banks are idle and CKE is inactive, then Self Refresh mode.
6. Illegal if t
7. Illegal if t
8. Must satisfy burst interrupt condition.
9. Must satisfy bus contention, bus turn around, and/or write recovery requirements.
10. Must mask preceding data which don
11. Illegal if t
12. Illegal for single bank, but legal for other banks in multi-bank devices.
13. Illegal for all banks.
Rev 1.0 / Dec. 2010
depending on the state of that bank.
RCD
RAS
RRD
is not satisfied.
is not satisfied.
is not satisfied
'
t care, BA: Bank Address, AP: Auto Precharge.
'
t satisfy t
DPL
.
Synchronous DRAM Memory 256Mbit
H57V2562GTR Series
20