MAX4113ESA Maxim Integrated Products, MAX4113ESA Datasheet - Page 10

• Manufacturer Part Number: MAX4113ESA
• Description: Op Amps
• Manufacturer: Maxim Integrated Products

Specifications of MAX4113ESA

• Number Of Channels: 1
• Common Mode Rejection Ratio (min): 45 dB
• Input Offset Voltage: 8 mV
• Maximum Power Dissipation: 471 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: SOIC-8 Narrow
• Maximum Dual Supply Voltage: +/- 6 V
• Minimum Operating Temperature: - 40 C

Single/Dual/Quad, 400MHz, Low-Power,
Current Feedback Amplifiers
At low gains, G x R
bandwidth is essentially independent of closed-loop
gain. Similarly, Z
The MAX4112/MAX4113/MAX4117–MAX4120 have an
RF bandwidth and consequently require careful board
layout, including the possible use of constant-impedance
microstrip or stripline techniques.
To realize the full AC performance of these high-speed
amplifiers, pay careful attention to power-supply
bypassing and board layout. The PC board should
have at least two layers: a signal and power layer on
one side, and a large, low-impedance ground plane on
the other side. The ground plane should be as free of
voids as possible. With multilayer boards, locate the
ground plane on a layer that incorporates no signal or
power traces.
Regardless of whether a constant-impedance board is
used, observe the following guidelines when designing
the board. Wire-wrapped boards are much too induc-
tive, and breadboards are much too capacitive; neither
should be used. IC sockets increase parasitic capaci-
tance and inductance, and should not be used. In gen-
eral, surface-mount components give better high-
frequency performance than through-hole components.
They have shorter leads and lower parasitic reac-
tances. Keep lines as short and as straight as possible.
Do not make 90° turns; round all corners.
Observe high-frequency bypassing techniques to
maintain the amplifier’s accuracy. The bypass capaci-
tors should include a 1000pF ceramic capacitor
between each supply pin and the ground plane, locat-
ed as close to the package as possible. Next, place a
Table 1. Recommended Component Values
10
R
R
R
R
-3dB Small-Signal Bandwidth (MHz)
0.1dB Gain Flatness (MHz)
Large-Signal Bandwidth (MHz)
F
G
O
T
(Ω)
(Ω)
______________________________________________________________________________________
(Ω)
(Ω)
Layout and Power-Supply Bypassing
COMPONENT
V
V
OUT
IN
OL
IN
>> R
<< R
G
F
at low frequencies, so that:
F
. Therefore, the closed-loop
1
R / R
F
MAX4112
G
49.9
49.9
600
600
400
100
280
A
MAX4117
VCL
49.9
49.9
600
600
400
100
280
= +2
0.01µF to 0.1µF ceramic capacitor in parallel with each
1000pF capacitor, and as close to them as possible.
Then place a 10µF to 15µF low-ESR tantalum at the
point of entry (to the PC board) of the power-supply
pins. The power-supply trace should lead directly from
the tantalum capacitor to the V
minimize parasitic inductance, keep PC traces short
and use surface-mount components.
Figure 2a. Inverting Gain Configuration
Figure 2b. Noninverting Gain Configuration
V
MAX4119
V
OUT
OUT
49.9
49.9
500
500
270
100
145
= -(R
= [1+ (R
V
R
IN
T
F
/R
G
F
) x V
/R
G
)] x V
V
IN
IN
MAX4113
R
R
G
G
IN
R
49.9
49.9
500
270
115
240
S
69
R
T
A
R
R
MAX4118
F
F
VCL
CC
49.9
49.9
330
300
115
240
47
= +8
and V
MAX4112
MAX4113
MAX4117
MAX4118
MAX4119
MAX4120
MAX4112
MAX4113
MAX4117
MAX4118
MAX4119
MAX4120
R
R
O
O
EE
MAX4120
pins. To
49.9
49.9
330
300
115
240
47
V
V
OUT
OUT