UPC 2758T-E3 Renesas Electronics America, UPC 2758T-E3 Datasheet - Page 3

• Manufacturer Part Number: UPC 2758T-E3
• Manufacturer: Renesas Electronics America

Specifications of UPC 2758T-E3

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Document No. P10764EJ3V0DS00 (3rd edition)
Document No. P10764EJ3V0DS00 (3rd edition)
Date Published June 1999 N
Date Published June 1999 N CP(K)
Printed in Japan
Printed in Japan
DESCRIPTION
cellular/cordless telephone receiver stage. This IC consists of mixer and local amplifier. Due to optimized circuit
current, the PC8112T improves RF performance such as intermodulation, leakage and linearity compared with
conventional Si MMIC of the PC2757T and PC2758T. The PC8112T features 3 V supply voltage and mini mold
package which contribute to make system lower voltage, space decreased and fewer components.
silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution
and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
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APPLICATIONS
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ORDERING INFORMATION
The
The PC8112T is manufactured using NEC’s 20 GHz f
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample
Excellent RF performance
Similar conversion gain to PC2757T and lower noise figure than PC2758T
Minimized carrier leakage
High linearity
Low current consumption
Supply voltage
High-density surface mounting : 6-pin minimold package
1.5 GHz to 1.9 GHz cellular/cordless telephone (example: PHS, DECT, PDC1. 5G)
800 MHz to 900 MHz cellular telephone (example: PDC 800 M)
Part Number
PC8112T-E3
PC8112T is a silicon monolithic integrated circuit designed as 1st frequency down-converter for
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
SILICON MMIC 1st FREQUENCY DOWN-CONVERTER
order)
6-pin minimold
Package
FOR CELLULAR/CORDLESS TELEPHONE
BIPOLAR ANALOG INTEGRATED CIRCUIT
: IIP
: Po
: RF
: I
: V
IM
RF
Po
Caution Electro-static sensitive devices
CC
Marking
CC
3
C2K
3
(sat)
(sat)
IO
IO
The mark
= 8.5 mA TYP.
= –88 dBm@P
= –7 dBm@f
= 2.7 to 3.3 V
= –80 dB@f
= –55 dB@f
DATA SHEET
= –2.5 dBm TYP.@f
= –3 dBm TYP.@f
• Embossed tape 8 mm wide.
• Pin 1, 2, 3 face to perforation side of the tape.
• QTY 3k/reel.
shows major revised points.
RFin
RFin
RFin
RFin
= 1.9 GHz (reference)
= 900 MHz (reference)
= 1.9 GHz (reference)
T
= –38 dBm, 1.9 GHz (reference); on test circuit
NESAT™III silicon bipolar process. This process uses
RFin
RFin
= 1.9 GHz
= 900 MHz
Supplying Form
PC8112T
©
1995, 1999