UPC 2758T-E3 Renesas Electronics America, UPC 2758T-E3 Datasheet - Page 20

• Manufacturer Part Number: UPC 2758T-E3
• Manufacturer: Renesas Electronics America

Specifications of UPC 2758T-E3

• Lead Free Status / Rohs Status: Supplier Unconfirmed

NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) The bypass capacitor (example: 1 000 pF) should be attached to the V
(5) The matching circuit should be externally attached to the IF output pin.
(6) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
18
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Method
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25 C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
Package peak temperature: 235 C or below
Time: 30 seconds or less (at 210 C)
Count: 3, Exposure limit: None
Package peak temperature: 215 C or below
Time: 40 seconds or less (at 200 C)
Count: 3, Exposure limit: None
Soldering bath temperature: 260 C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Pin temperature: 300 C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Soldering Conditions
Note
Data Sheet P10764EJ3V0DS00
Note
Note
Note
CC
pin.
Recommended Condition Symbol
For soldering methods and
WS60-00-1
VP15-00-3
IR35-00-3
–
PC8112T