BGA2022 NXP Semiconductors, BGA2022 Datasheet - Page 2
![](/photos/31/40/314064/sot363_sml.jpg)
BGA2022
Manufacturer Part Number
BGA2022
Description
Manufacturer
NXP Semiconductors
Datasheet
1.BGA2022.pdf
(8 pages)
Specifications of BGA2022
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Philips Semiconductors
FEATURES
APPLICATIONS
Receiver side of wireless systems
that require high conversion gain and
high linearity at low supply current,
such as CDMA.
DESCRIPTION
Silicon double poly MMIC mixer in a
6-lead SOT363 plastic package.
QUICK REFERENCE DATA
V
2000 Dec 04
G
NF
IP
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
S
SYMBOL
Large frequency range:
– Cellular band (900 MHz)
– PCS band (1900 MHz)
– WLAN band (2.4 GHz)
High isolation
High linearity
High conversion gain.
MMIC mixer
conv
3
= 2.8 V; I
S
= 6 mA; P
conversion gain
noise figure (DSB)
output third order intercept point
LO
= 0 dBm; f
PARAMETER
RF
= 1800 MHz; f
PINNING
handbook, 4 columns
Marking code: A2p.
PIN
1
2
3
4
5
6
6
1
Top view
5
2
CAUTION
LO
Fig.1 Simplified outline (SOT363) and symbol.
LO - GND
LO - signal
V
IF - out
RF - feedback
RF - signal
= 2080 MHz; f
S
2
4
3
RF- signal
LO - GND
IF
= 280 MHz.
4
6
1
MIN.
CONTROL
DESCRIPTION
BIAS
RF- feedback
6
12
7
LO - signal
TYP.
5
2
Product specification
8
MAX.
BGA2022
IF- out
MBL255
V S
4
3
dB
dB
dBm
UNIT