TEA5777 NXP Semiconductors, TEA5777 Datasheet - Page 44

• Manufacturer Part Number: TEA5777
• Manufacturer: NXP Semiconductors

Specifications of TEA5777

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Philips Semiconductors
15. Package outline
Fig 10. Package outline SOT619-1 (HVQFN48)
TEA5777_1
Product data sheet
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 x 7 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT619-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
12
1
0.30
0.18
b
e
13
48
IEC
- - -
0.2
c
D
7.1
6.9
(1)
5.25
4.95
D h
e 1
D h
D
MO-220
JEDEC
1/2
E
7.1
6.9
e
(1)
REFERENCES
0
Rev. 01 — 11 April 2006
5.25
4.95
b
E h
Low-power AM/FM stereo radio for handheld applications
37
0.5
24
e
JEITA
scale
25
36
2.5
- - -
B
1/2
e
5.5
e 1
e
w
v
A
E
M
M
e 2
5.5
e 2
C
C
A
5 mm
B
0.5
0.3
L
A
0.1
v
A 1
y 1 C
0.05
w
PROJECTION
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
EUROPEAN
0.05
detail X
y
0.1
y 1
X
C
TEA5777
y
ISSUE DATE
01-08-08
02-10-18
SOT619-1
c
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