HMMC-5026 Avago Technologies US Inc., HMMC-5026 Datasheet - Page 4

• Manufacturer Part Number: HMMC-5026
• Manufacturer: Avago Technologies US Inc.
• Type: General Purposer

Specifications of HMMC-5026

• Number Of Channels: 1
• Frequency (max): 26.5GHz
• Output Power: 15@26500MHzdBm
• Power Supply Requirement: Single
• Single Supply Voltage (max): 8V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Supply Current: 250@7VmA
• Lead Free Status / Rohs Status: Compliant

4
Figure 2. HMMC-5021/26 Bonding Pad Locations.
Figure 3. HMMC-5021/26 Assembly Diagram. (For 2.0 –26.5 GHz Operation)
(±10 µm)
Trace Offset
(0.7 mil Gold Wire Bond
(6.6 mils)
(RF Input Pad)
with length ≥150 mils)
770
168 µm
≥4 nH Inductor
225
225
Drain
Input
Aux.
V
RF
0.7 mil dia. Gold Bond Wire
DD
(Length NOT important)
85
1.5 mil dia.Gold Wire
Bond to ≥15 nF
80
DC Feedthru
270
(V
75
DD
and Aux Drain Pads)
Chip ID No.
nom. gap
V
IN
2.0 mil
DD
1695
Gold Plated Shim
nom. gap
V
2.0 mil
G1
Temp. Diode Sense
OUT
≥68 pF Capacitor
2980 (± 10 µm)
Bonding Island
Bond to ≥15 nF DC Feedthru
1.5 mil dia.Gold Wire
Diode Force
200
Temp.
Trace Offset
Input and Output Thin Film
(6.6 mils)
168 µm
DC Blocking Capacitor
Circuit with ≥8 pF
200
V
G1
(RF Output Pad)
695
Aux. Gate
(V
G2
Note:
Total offset between RF input
and RF output pad is 335 µm
(13.2 mils).
Notes:
All dimensions in microns.
Rectangular Pad Dim: 75 x 75 µm.
Octagonal Pad Dim: 90 µm dia.
All other dimensions ±5 µm
Chip thickness: 127 ± 15 µm.
490
80
Pad)
(unless otherwise noted).
75
Output
80
RF
V
G2
300
560