CY23S09ZC-1 Cypress Semiconductor Corp, CY23S09ZC-1 Datasheet - Page 7

• Manufacturer Part Number: CY23S09ZC-1
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY23S09ZC-1

• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-07296 Rev. *C
Package Diagrams
0.050[1.270]
BSC
8
9
0.050[1.270]
BSC
16 Lead (150 Mil) SOIC
5
4
0.386[9.804]
0.393[9.982]
8 Lead (150 Mil) SOIC - S08
0.0138[0.350]
0.0192[0.487]
0.189[4.800]
0.196[4.978]
0.0138[0.350]
0.0192[0.487]
1
8
0.004[0.102]
0.0098[0.249]
16
1
0.150[3.810]
0.157[3.987]
PIN 1 ID
16-Lead (150-Mil) SOIC S16.15
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.150[3.810]
0.157[3.987]
8-lead (150-Mil) SOIC S8
0.230[5.842]
0.244[6.197]
0.061[1.549]
0.068[1.727]
PIN 1 ID
0.004[0.102]
0.230[5.842]
0.244[6.197]
0.004[0.102]
SEATING PLANE
0°~8°
SEATING PLANE
2. PIN 1 ID IS OPTIONAL,
1. DIMENSIONS IN INCHES[MM] MIN.
3. REFERENCE JEDEC MS-012
4. PACKAGE WEIGHT 0.07gms
0°~8°
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
DIMENSIONS IN INCHES[MM] MIN.
REFERENCE JEDEC MS-012
PACKAGE WEIGHT 0.15gms
0.016[0.406]
0.035[0.889]
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
PART #
0.016[0.406]
0.035[0.889]
PART #
0.010[0.254]
0.016[0.406]
MAX.
0.010[0.254]
0.016[0.406]
51-85066-*C
X 45°
51-85068-*B
0.0075[0.190]
0.0098[0.249]
MAX.
CY23S09
CY23S05
0.0075[0.190]
0.0098[0.249]
X 45°
Page 7 of 9
[+] Feedback