TE28F400B3B90 Intel, TE28F400B3B90 Datasheet - Page 14

• Manufacturer Part Number: TE28F400B3B90
• Manufacturer: Intel

Specifications of TE28F400B3B90

• Cell Type: NOR
• Density: 4Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 18b
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 256K
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
8
Figure 5. x16 48-Ball Very Fine Pitch BGA and µBGA* Chip Size Package (Top View, Ball
Down)
NOTES:
Table 2, “3-Volt Advanced Boot Block Pin Descriptions” on page 9
device pin.
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the
2. 4-Mbit density not available in BGA CSP.
upper address solder balls. Routing is not recommended in this area. A
16-Mbit device. A
device.
C
D
A
B
E
F
V
GND
A
A
A
A
CCQ
1
13
14
15
16
20
is the upgrade address for the 32-Mbit device. A
D
D
A
A
A
D
2
11
10
12
14
15
7
WE#
D
A
A
D
D
3
13
8
9
5
6
64M
RP#
V
A
D
D
D
4
PP
21
11
12
4
32M
WP#
V
A
A
D
D
5
CC
18
20
2
3
16M
21
is the upgrade address for the 64-Mbit
A
A
D
19
A
D
D
6
19
17
10
6
8
9
details the usage of each
is the upgrade address for the
CE#
D
D
7
A
A
A
7
5
3
0
1
GND
OE#
A
A
A
A
8
Preliminary
4
2
1
0
0580_03