M93C66-WDW6T STMicroelectronics, M93C66-WDW6T Datasheet - Page 31

• Manufacturer Part Number: M93C66-WDW6T
• Manufacturer: STMicroelectronics

Specifications of M93C66-WDW6T

• Density: 4Kb
• Interface Type: Serial (Microwire)
• Organization: 512x8/256x16
• Frequency (max): 2MHz
• Write Protection: No
• Data Retention: 40Year
• Operating Supply Voltage (typ): 3.3/5V
• Package Type: TSSOP
• Operating Temp Range: -40C to 85C
• Supply Current: 2mA
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / Rohs Status: Not Compliant

M93C86, M93C76, M93C66, M93C56, M93C46
Figure 14. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
3. The circle in the top view of the package indicates the position of pin 1.
Table 26.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
Symbol
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
measuring.
ddd
A1
D2
E2
L1
L3
A
D
E
b
e
L
(2)
2 x 3 mm, outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
A
0.55
0.02
0.25
0.45
Typ
1.6
0.2
0.5
2
3
E
A1
millimeters
0.45
0.08
D
Min
0.2
1.9
1.5
2.9
0.1
0.4
0.3
0
-
Max
0.05
0.15
0.6
0.3
2.1
1.7
3.1
0.3
0.5
ddd
-
L3
0.0217
0.0008
0.0098
0.0787
0.1181
0.0079
0.0177
0.0197
0.063
Typ
D2
e
Package mechanical data
b
inches
0.0177
0.0079
0.0748
0.0591
0.1142
0.0039
0.0157
0.0118
UFDFPN-01
0.08
Min
SS
0
-
L1
E2
L
. It must not be
(1)
0.0236
0.0118
0.0827
0.0669
0.0118
0.0197
0.0059
0.002
0.122
Max
-
31/37