BC848W NXP Semiconductors, BC848W Datasheet
BC848W
Specifications of BC848W
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BC848W Summary of contents
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... FE Product overview Package NXP JEITA SOT23 - SOT323 SC-70 Quick reference data Parameter Conditions collector-emitter voltage open base collector current DC current gain BC848B BC848W Product data sheet PNP complement JEDEC TO-236AB BC858B - BC858W Min Typ Max Unit - - 100 mA 200 290 450 ...
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... Table 3. Pin Ordering information Table 4. Type number BC848B BC848W 4. Marking Table 5. Type number BC848B BC848W [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors Pinning Description base emitter collector Ordering information ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... BEsat [3] V decreases by approximately 2 mV/K with increasing temperature. BE BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors Characteristics C unless otherwise specified. Conditions 150 ° μ BC848B BC848W mA 100 mA mA 100 100 MHz = MHz = 200 μ kΩ kHz; ...
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... NXP Semiconductors 600 h FE (1) 500 400 (2) 300 200 (3) 100 0 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 1. BC848B: DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 − 150 °C (1) T amb = 25 °C (2) T amb = − ...
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... Package outline SOT23 (TO-236AB) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BC848B BC848W [1] For further information and the availability of packing methods, see BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors 1 ...
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... NXP Semiconductors 10. Soldering Dimensions in mm Fig 7. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Dimensions in mm Fig 8. Wave soldering footprint SOT23 (TO-236AB) BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors 2.90 2. 0.85 1.30 3.00 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x) ...
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... NXP Semiconductors Fig 9. Reflow soldering footprint SOT323 (SC-70) 3.65 Fig 10. Wave soldering footprint SOT323 (SC-70) BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors 2.65 0.75 1.325 1. 0.60 2.35 0.85 (3×) 1 0.55 (3×) 2.40 4.60 4.00 1. 2.10 1 preferred transport direction during soldering Rev. 07 — ...
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... NXP Semiconductors 11. Mounting Dimensions in mm PCB thickness: FR4 PCB = 1.6 mm Fig 11. FR4 PCB, standard footprint SOT23 (TO-236AB) BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors 43.4 0.7 0.6 40 0.6 0.7 0.5 006aaa527 Rev. 07 — 17 November 2009 BC848 series 43.4 0.6 ...
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... Data sheet status Change notice Product data sheet - (SC-70)”: updated (SC-70)”: updated Product data sheet - Product specification - Product specification - Rev. 07 — 17 November 2009 BC848 series Supersedes BC848_SER_6 BC846_BC847_ BC848_5 BC846W_BC847W_ BC848W_4 BC846_BC847_ BC848_4 BC846W_847W_3 © NXP B.V. 2009. All rights reserved ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information . . . . . . . . . . . . . . . . . . . . . 6 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 Mounting Revision history ...