AM29LV400BB-120EC Spansion Inc., AM29LV400BB-120EC Datasheet - Page 10

• Manufacturer Part Number: AM29LV400BB-120EC
• Manufacturer: Spansion Inc.

Specifications of AM29LV400BB-120EC

• Cell Type: NOR
• Density: 4Mb
• Access Time (max): 120ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 19/18Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: 0C to 70C
• Package Type: TSOP
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 512K/256K
• Supply Current: 12mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combi-
nation) is formed by a combination of the elements below.
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
8
AM29LV400BT55R,
AM29LV400BB55R
AM29LV400BT70,
AM29LV400BB70
AM29LV400BT90,
AM29LV400BB90
AM29LV400BT120,
AM29LV400BB120
Am29LV400B
Valid Combinations for TSOP and SO Packages
T
Valid Combinations
DEVICE NUMBER/DESCRIPTION
Am29LV400B
4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
ED, EF, EK, EC, EI, FC, FD, FF, FK,
-55R
ED, EF, EK, FD, FF, FK
FI, SC, SI, SD, SF, SK
E
EC, EI, EE,
SC, SI, SE,
FC, FI, FE,
SD, SF, SK
C
TEMPERATURE RANGE
D
C
F
I
K
E
PACKAGE TYPE
E
F
S
WA
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
D A T A
=
=
=
=
=
=
=
=
=
=
=
=
Commercial (0°C to +70°C); Lead (Pb)-Free Package
Commercial (0°C to +70°C)
Industrial (-40°C to 85°C); Lead (Pb)-Free Package
Industrial (–40
Extended (–55
Extended (–55
48-Pin Thin Small Outline Package (TSOP) Standard Pinout (TS 048)
48-Pin Thin Small Outline Package (TSOP) Reverse Pinout (TSR048)
44-Pin Small Outline Package (SO 044)
48-Ball Fine Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 6 x 8 mm package (FBA048)
Am29LV400B
Top sector
Bottom sector
S H E E T
AM29LV400BT55R,
AM29LV400BB55R
AM29LV400BT70,
AM29LV400BB70
AM29LV400BT90,
AM29LV400BB90
AM29LV400BT120,
AM29LV400BB120
°
°
°
C to +85
C to +125
C to +125
Valid Combinations for FBGA Packages
Order Number
°
C)
°
°
C); Lead (Pb)-Free Package
C)
WAE,WAD,
WAD,WAF,
WAC, WAI,
WAC,WAI,
WAF,WAK
WAK
21523D4 December 4, 2006
L400BT55R,
L400BB55R
L400BT70V,
L400BB70V
L400BT90V,
L400BB90V
L400BT12V,
L400BB12V
Package Marking
C, I, D,
C, I, E,
D, F, K
F, K