B37940R5220K43 EPCOS Inc, B37940R5220K43 Datasheet - Page 12

• Manufacturer Part Number: B37940R5220K43
• Manufacturer: EPCOS Inc
• Type: Ceramicr

Specifications of B37940R5220K43

• Capacitance: 22pF
• No. Of Capacitors: 4
• Tolerance (+ Or -): 10%
• Voltage: 50VDC
• Number Of Terminals: 8Terminal
• Temp Coeff (dielectric): C0G
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Package / Case: 0508
• Construction: SMT Chip
• Failure Rate: Not Required
• Product Height (mm): 0.85mm
• Product Depth (mm): 1.25mm
• Product Length (mm): 2mm
• Lead Diameter (nom): Not Requiredmm
• Terminal Pitch: 0.5mm
• Lead Free Status / Rohs Status: Compliant

The following should be considered in the placement process
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
Multilayer ceramic capacitors
Cautions and warnings
as these may damage the capacitor.
snap-in components): danger of bending and fracture.
board not to damage the components.
board.
for them (see the chapter “Soldering directions”).
temperature, cooling time) in order to avoid thermal stresses and damage.
process: they were developed only for conductive adhesion technology.
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