CY7C1355B-133AC Cypress Semiconductor Corp, CY7C1355B-133AC Datasheet - Page 17

CY7C1355B-133AC

Manufacturer Part Number
CY7C1355B-133AC
Description
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1355B-133AC

Density
9Mb
Access Time (max)
6.5ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
133MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
18b
Package Type
TQFP
Operating Temp Range
0C to 70C
Number Of Ports
1
Supply Current
250mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.63V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
256K
Lead Free Status / Rohs Status
Not Compliant
Document #: 38-05117 Rev. *C
possible to capture all other signals and simply ignore the
value of the CLK captured in the boundary scan register.
Once the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the
boundary scan register between the TDI and TDO balls.
Note that since the PRELOAD part of the command is not
implemented, putting the TAP to the Update-DR state while
performing a SAMPLE/PRELOAD instruction will have the
same effect as the Pause-DR command.
TAP AC Switching Characteristics
Clock
t
t
t
t
Output Times
t
t
Set-up Times
t
t
t
Hold Times
t
t
t
Notes:
10. Test conditions are specified using the load in TAP AC Test Conditions. t
Parameter
TCYC
TF
TH
TL
TDOV
TDOX
TMSS
TDIS
CS
TMSH
TDIH
CH
9. t
CS
and t
CH
refer to the set-up and hold time requirements of latching data from the boundary scan register.
TCK Clock Cycle Time
TCK Clock Frequency
TCK Clock HIGH time
TCK Clock LOW time
TCK Clock LOW to TDO Valid
TCK Clock LOW to TDO Invalid
TMS Set-Up to TCK Clock Rise
TDI Set-Up to TCK Clock Rise
Capture Set-Up to TCK Rise
TMS hold after TCK Clock Rise
TDI Hold after Clock Rise
Capture Hold after Clock Rise
Test Mode Select
Test Data-Out
Test Data-In
Test Clock
(TDO)
(TMS)
(TCK)
(TDI)
1
Description
Over the operating Range
t TMSS
t TDIS
2
t TMSH
t TDIH
t TH
TAP Timing
DON’T CARE
R
/t
t
F
TL
= 1 ns.
3
BYPASS
When the BYPASS instruction is loaded in the instruction
register and the TAP is placed in a Shift-DR state, the bypass
register is placed between the TDI and TDO balls. The
advantage of the BYPASS instruction is that it shortens the
boundary scan path when multiple devices are connected
together on a board.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
t CYC
[9, 10]
UNDEFINED
4
t TDOX
t TDOV
5
Min.
50
25
25
0
5
5
5
5
5
5
6
Max.
CY7C1355B
CY7C1357B
20
5
Page 17 of 32
MHz
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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