TE28F800F3T95 Intel, TE28F800F3T95 Datasheet - Page 33

• Manufacturer Part Number: TE28F800F3T95
• Manufacturer: Intel

Specifications of TE28F800F3T95

• Cell Type: NOR
• Density: 8Mb
• Access Time (max): 95ns
• Interface Type: Parallel
• Boot Type: Top
• Address Bus: 19b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 512K
• Supply Current: 60mA
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Not Compliant

28F800F3—Automotive
Transient current magnitudes depend on the device outputs’ capacitive and inductive loading. Two-
line control and proper de-coupling capacitor selection will suppress these transient voltage peaks.
Each flash device should have a 0.1 µF ceramic capacitor connected between each V
and GND,
CC
and between its V
and GND. These high- frequency, inherently low-inductance capacitors should
PP
be placed as close as possible to the package leads.
7.5.1
V
Trace on Printed Circuit Boards
PP
Designing for in-system writes to the flash memory requires special consideration of the V
power
PP
supply trace by the printed circuit board designer. The V
pin supplies the flash memory cells
PP
current for programming and erasing. V
trace widths and layout should be similar to that of V
.
PP
CC
Adequate V
supply traces, and de-coupling capacitors placed adjacent to the component, will
PP
decrease spikes and overshoots.
PRELIMINARY
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