TEA6321T NXP Semiconductors, TEA6321T Datasheet - Page 32

• Manufacturer Part Number: TEA6321T
• Manufacturer: NXP Semiconductors

Specifications of TEA6321T

• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
PACKAGE OUTLINE
1995 Dec 19
SO32: plastic small outline package; 32 leads; body width 7.5 mm
Sound fader control circuit
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
Note
UNIT
mm
VERSION
OUTLINE
SOT287-1
32
1
Z
max.
y
2.65
0.10
A
0.012
0.004
0.3
0.1
pin 1 index
A
1
0.096
0.086
e
2.45
2.25
A
2
IEC
0.25
0.01
A
3
0.49
0.36
0.02
0.01
b
D
p
0.011
0.007
0.27
0.18
JEDEC
c
REFERENCES
20.7
20.3
0.81
0.80
D
0
(1)
0.30
0.29
E
7.6
7.4
(1)
scale
0.050
EIAJ
1.27
32
5
e
b
p
16
17
0.419
0.394
10.65
10.00
H
E
w
c
M
0.055
10 mm
1.4
L
A
0.043
0.016
1.1
0.4
2
L
p
A
1
0.047
0.039
1.2
1.0
Q
H
E
PROJECTION
E
EUROPEAN
0.25
0.01
detail X
v
L
0.25
0.01
Preliminary specification
L
w
p
Q
(A )
0.004
0.1
A
3
y
TEA6321
ISSUE DATE
95-01-25
97-05-22
0.037
0.022
0.95
0.55
X
Z
A
v
(1)
SOT287-1
M
A
8
0
o
o