PCF8563P NXP Semiconductors, PCF8563P Datasheet - Page 38

• Manufacturer Part Number: PCF8563P
• Manufacturer: NXP Semiconductors

Specifications of PCF8563P

• Bus Type: Serial (2-Wire, I2C)
• Date Format: DW:DM:M:Y
• Time Format: HH:MM:SS
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Package Type: PDIP
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 1.8V
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Pin Count: 8
• Mounting: Through Hole
• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
PCF8563
Product data sheet
17.3 Wave soldering
17.4 Reflow soldering
Key characteristics in wave soldering are:
Key characteristics in reflow soldering are:
Table 31.
Table 32.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 31
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
32
33.
Rev. 7 — 23 July 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
33) than a SnPb process, thus
≥ 350
220
220
Real-time clock/calendar
245
> 2000
260
245
PCF8563
© NXP B.V. 2010. All rights reserved.
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