BUK139-50DL NXP Semiconductors, BUK139-50DL Datasheet - Page 5

• Manufacturer Part Number: BUK139-50DL
• Manufacturer: NXP Semiconductors
• Type: Power MOSFETr

Specifications of BUK139-50DL

• Number Of Elements: 1
• Polarity: N
• Channel Mode: Enhancement
• Drain-source On-res: 0.1Ohm
• Drain-source On-volt: 50V
• Continuous Drain Current: 16A
• Power Dissipation: 65W
• Operating Temp Range: -55C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 2 +Tab
• Package Type: DPAK
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
MECHANICAL DATA
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.1 g
July 2001
Logic level TOPFET
D-PAK version of BUK118-50DL
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads
(one lead cropped)
Note
1. Measured from heatsink back to lead.
DIMENSIONS (mm are the original dimensions)
UNIT
mm
Fig.2. SOT428 surface mounting package
VERSION
OUTLINE
SOT428
max.
2.38
2.22
L 2
A
A 1
0.65
0.45
(1)
b 1
0.89
0.71
A 2
1
e
0.89
0.71
b 2
e 1
IEC
E
b
2
max.
1.1
0.9
b 1
b
5.36
5.26
b 2
3
JEDEC
w
0.4
0.2
D
L
A
c
M
H E
REFERENCES
A
max.
6.22
5.98
D
mounting
0
max.
4.81
4.45
base
D 1
seating plane
L 1
A 1
max.
scale
6.73
6.47
EIAJ
10
5
E
1
c
A 2
, centre pin connected to mounting base.
min.
4.0
A
E 1
20 mm
y
2.285 4.57
e
e 1
E 1
max.
10.4
H E
9.6
2.95
2.55
L
PROJECTION
EUROPEAN
min.
0.5
L 1
D 1
0.7
0.5
L 2
0.2
w
ISSUE DATE
98-04-07
BUK139-50DL
Product specification
max.
0.2
y
SOT428
Rev 2.000