HEF4894BT NXP Semiconductors, HEF4894BT Datasheet
HEF4894BT
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HEF4894BT Summary of contents
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... Name Description HEF4894BP DIP20 plastic dual in-line package; 20 leads (300 mil) HEF4894BT SO20 plastic small outline package; 20 leads; body width 7.5 mm HEF4894BTT TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm power supply range referenced ° C. Product data sheet , another input ...
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... NXP Semiconductors 5. Functional diagram Fig 1. Logic Symbol STR 19 OE QP0 Fig 2. Functional diagram HEF4894B Product data sheet STR QS1 QS2 QP0 QP1 QP2 2 D QP3 QP4 QP5 QP6 QP7 QP8 QP9 QP10 QP11 OE 19 12-STAGE SHIFT REGISTER 12-BIT STORAGE REGISTER OPEN-DRAIN OUTPUTS ...
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... NXP Semiconductors D CP STR OE Fig 3. Logic diagram 6. Pinning information 6.1 Pinning Fig 4. Pin configuration HEF4894B Product data sheet STAGE 0 STAGE Q10S FF0 LATCH LE QP0 QP1 QP10 STR QP0 4 QP1 5 HEF4894B QP2 6 QP3 7 QP4 8 9 QP5 001aag117 All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 6.2 Pin description Table 2. Pin description Symbol Pin D 2 QP0 to QP11 18, 17, 16, 15, 14, 13 QS1 11 QS2 STR Functional description [1] Table 3. Function table At the positive clock edge the information in the 10 Control CP OE STR ↑ ↓ ↑ ↑ ↑ ↓ HIGH voltage level LOW voltage level don’t care; ↑ = LOW-to-HIGH clock transition; ↓ = HIGH-to-LOW clock transition; ...
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... NXP Semiconductors clock input data input strobe input output enable input internal Q0S (FF 1) QP0 output internal Q10S (FF 11) QP10 output serial QS1 output serial QS2 output Fig 5. Timing diagram 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter V supply voltage DD V input voltage I T ambient temperature amb Δt/ΔV input transition rise and fall rate 10. Static characteristics Table 6. Static characteristics unless otherwise specified Symbol Parameter Conditions |I | < 1 μA ...
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... NXP Semiconductors Table 6. Static characteristics unless otherwise specified Symbol Parameter Conditions I OFF-state QPn output OZ output current is HIGH supply current input I capacitance 11. Dynamic characteristics Table 7. Dynamic characteristics ° unless otherwise specified. For test circuit see SS amb Symbol Parameter Conditions t HIGH to LOW CP to QS1; ...
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... NXP Semiconductors Table 7. Dynamic characteristics ° unless otherwise specified. For test circuit see SS amb Symbol Parameter Conditions QPn; en see QPn; dis see t transition time QS1, QS2; t see t pulse width CP; LOW and HIGH; W see STR; HIGH; see t set-up time D to CP; su see ...
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... NXP Semiconductors 12. Waveforms CP input QPn output QS1 output QS2 output Parallel output measurement points are given in V and V are typical output voltage levels that occur with the output load Fig 6. Propagation delay clock (CP) to output (QPn, QS1, QS2), clock pulse width and maximum clock frequency Table 9 ...
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... NXP Semiconductors LOW to OFF-state OFF-state to LOW Measurement points are given the typical output voltage level that occurs with the output load. OL Fig 8. Enable and disable times for input OE CP input QPn output Measurement points are given typical output voltage level that occurs with the output load. ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit: DUT - Device Under Test Load resistance load capacitance Termination resistance should be equal to output impedance External voltage for measuring switching times. EXT Fig 10. Test circuit for measuring switching times Table 10. Test data ...
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... NXP Semiconductors 13. Application information Application example: serial-to-parallel data converting LED driver QP0 QP1 STR PWM dimmer input CONTROL AND SYNC CIRCUITRY DATA CLOCK from remote processor Fig 11. Serial-to-parallel converting LED drivers HEF4894B Product data sheet QP10 QP11 V HEF4894B QS2 All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 14. Package outline DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 15. Revision history Table 11. Revision history Document ID Release date HEF4894B v.7 20100813 • Modifications: Section 8 “Limiting values” HEF4894B v.6 20100408 HEF4894B v.5 20091222 HEF4894B v.4 20080827 HEF4894B_CNV v.3 19950101 HEF4894B_CNV v.2 19950101 HEF4894B Product data sheet 12-stage shift-and-store register LED driver ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales office addresses, please send an email to: HEF4894B Product data sheet 16 ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Application information ...