ADP5034ACPZ-1-R7 Analog Devices Inc, ADP5034ACPZ-1-R7 Datasheet - Page 6

• Manufacturer Part Number: ADP5034ACPZ-1-R7
• Description: IC REG BUCK DUAL 3MHZ 24-LFCSP
• Manufacturer: Analog Devices Inc
• Series: -r

Specifications of ADP5034ACPZ-1-R7

• Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
• Function: Any Function
• Number Of Outputs: 4
• Frequency - Switching: 3MHz
• Voltage/current - Output 1: 0.8 V ~ 3.8 V, 1.2A
• Voltage/current - Output 2: 0.8 V ~ 3.8 V, 1.2A
• Voltage/current - Output 3: 0.8 V ~ 4.75 V, 300mA
• W/led Driver: No
• W/supervisor: No
• W/sequencer: No
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: *
• Package / Case: *
• Operating Temperature Range: -40°C To +125°C
• No. Of Regulated Outputs: 4
• Supply Voltage: 5.5V
• No. Of Step-down Dc - Dc Converters: 2
• Digital Ic Case Style: LFCSP
• No. Of Ldo Regulators: 2
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: ADP5034ACPZ-1-R7TR

ADP5034
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVIN, VIN1, VIN2, VIN3, VIN4, VOUT1,
SW1, SW2
VIN1, VIN2 to AVIN
Storage Temperature Range
Operating Junction Temperature
Soldering Conditions
ESD Human Body Model
ESD Charged Device Model
ESD Machine Model
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
For detailed information on power dissipation, see the Power
Dissipation and Thermal Considerations section.
VOUT2, VOUT3, VOUT4, FB1, FB2,
FB3, FB4, EN1, EN2, EN3, EN4,
MODE to Ground
Range
Rating
−0.3 V to +6 V
−0.3 V to (VIN1 + 0.3 V)
−0.3 V to +0.3 V
−65°C to +150°C
−40°C to +125°C
JEDEC J-STD-020
±1500 V
±500 V
±100 V
Rev. 0 | Page 6 of 28
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
24-Lead, 0.5 mm pitch LFCSP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
35
JA
θ
3
JC
Unit
°C/W