ADP5034ACPZ-1-R7 Analog Devices Inc, ADP5034ACPZ-1-R7 Datasheet - Page 24

• Manufacturer Part Number: ADP5034ACPZ-1-R7
• Description: IC REG BUCK DUAL 3MHZ 24-LFCSP
• Manufacturer: Analog Devices Inc
• Series: -r

Specifications of ADP5034ACPZ-1-R7

• Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
• Function: Any Function
• Number Of Outputs: 4
• Frequency - Switching: 3MHz
• Voltage/current - Output 1: 0.8 V ~ 3.8 V, 1.2A
• Voltage/current - Output 2: 0.8 V ~ 3.8 V, 1.2A
• Voltage/current - Output 3: 0.8 V ~ 4.75 V, 300mA
• W/led Driver: No
• W/supervisor: No
• W/sequencer: No
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: *
• Package / Case: *
• Operating Temperature Range: -40°C To +125°C
• No. Of Regulated Outputs: 4
• Supply Voltage: 5.5V
• No. Of Step-down Dc - Dc Converters: 2
• Digital Ic Case Style: LFCSP
• No. Of Ldo Regulators: 2
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: ADP5034ACPZ-1-R7TR

ADP5034
PCB LAYOUT GUIDELINES
Poor layout can affect ADP5034 performance, causing electro-
magnetic interference (EMI) and electromagnetic compatibility
(EMC) problems, ground bounce, and voltage losses. Poor
layout can also affect regulation and stability. A good layout is
implemented using the following guidelines. Also, refer to the
UG-271
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•
Place the inductor, input capacitor, and output capacitor
close to the IC using short tracks. These components carry
high switching frequencies, and large tracks act as antennas.
Route the output voltage path away from the inductor and
SW node to minimize noise and magnetic interference.
user guide.
Rev. 0 | Page 24 of 28
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•
Maximize the size of ground metal on the component side
to help with thermal dissipation.
Use a ground plane with several vias connecting to the
component side ground to further reduce noise
interference on sensitive circuit nodes.
Connect VIN1, VIN2, and AVIN together close to the IC
using short tracks.