STM8L151F3P6 STMicroelectronics, STM8L151F3P6 Datasheet - Page 95
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STM8L151F3P6
Manufacturer Part Number
STM8L151F3P6
Description
IC MCU 8BIT 8KB FLASH 20TSSOP
Manufacturer
STMicroelectronics
Series
STM8L EnergyLiter
Datasheet
1.STM8L151G3U6.pdf
(110 pages)
Specifications of STM8L151F3P6
Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, IR, POR, PWM, WDT
Number Of I /o
18
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-TSSOP (0.173", 4.40mm Width)
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STM8L151F3P6
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
STM8L151F3P6TR
Manufacturer:
TYCO
Quantity:
47
STM8L151x2, STM8L151x3
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Table 50.
Electromagnetic interference (EMI)
Based on a simple application running on the product (toggling 2 LEDs through the I/O
ports), the product is monitored in terms of emission. This emission test is in line with the
norm IEC61967-2 which specifies the board and the loading of each pin.
Table 51.
1. Not tested in production.
Absolute maximum ratings (electrical sensitivity)
Based on two different tests (ESD and LU) using specific measurement methods, the
product is stressed in order to determine its performance in terms of electrical sensitivity.
For more details, refer to the application note AN1181.
Symbol
Symbol
V
V
FESD
EFTB
S
EMI
Voltage limits to be applied on
any I/O pin to induce a functional
disturbance
Fast transient voltage burst limits
to be applied through 100 pF on
V
functional disturbance
DD
Peak level
EMS data
EMI data
Parameter
and V
SS
Parameter
pins to induce a
(1)
V
T
LQFP48
conforming to
IEC61967-2
A
DD
= +25 °C,
Doc ID 018780 Rev 2
= 3.6 V,
Conditions
V
f
conforms to IEC 61000
V
f
conforms to IEC 61000
CPU
CPU
DD
DD
= 16 MHz,
= 3.3 V, T
= 3.3 V, T
= 16 MHz,
0.1 MHz to 30 MHz
30 MHz to 130 MHz
130 MHz to 1 GHz
SAE EMI Level
frequency band
Monitored
A
A
= +25 °C,
= +25 °C,
Conditions
Using HSI
Using HSE
Electrical parameters
Max vs.
16 MHz
-3
9
2
4
Level/
Class
dBμV
95/110
Unit
2B
4A
2B
-