LFXP6C-3TN144I Lattice, LFXP6C-3TN144I Datasheet - Page 385
LFXP6C-3TN144I
Manufacturer Part Number
LFXP6C-3TN144I
Description
IC FPGA 5.8KLUTS 100I/O 144-TQFP
Manufacturer
Lattice
Datasheet
1.LFXP3C-3T100C.pdf
(397 pages)
Specifications of LFXP6C-3TN144I
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP6C-3TN144I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
144-ball csBGA BGA Breakout Examples
These examples place an ispMACH 4000ZE in a 7x7 mm, 0.5 mm pitch, 144-ball csBGA package (LC4256ZE-
MN144) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O utilization and a 4-layer with
about 5% fewer I/Os. The 6-layer (Example #1) design avoids uses of micro vias and takes advantage of removed
pads on inner layers to route all pins out to 6 layers with good layer structure for high-speed signal integrity.
Figure 14-8. CAM Artwork Screen Shots, Example #1, 144-ball csBGA
Layer 1 Primary
Layer 3 Signal
Layer 5 Power
14-10
Layer 6 Secondary
PCB Layout Recommendations
Layer 4 Signal
Layer 2 GND
for BGA Packages
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