NOII5SM1300A-QWC ON Semiconductor, NOII5SM1300A-QWC Datasheet - Page 31

• Manufacturer Part Number: NOII5SM1300A-QWC
• Manufacturer: ON Semiconductor

Specifications of NOII5SM1300A-QWC

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Table 27. Side View Dimensions (see
Die (with Pin 1 to the left
center, Top View)
Pixel (0,0) is bottom left
Glass lid specifications XY size
Mechanical shock
Vibration
Mounting profile
Dimension
Parameters
C
D
G
H
A
B
E
F
J
Glass (thickness) - mono
Cavity (depth)
Die - Si (thickness) - mono
Bottom layer (thickness)
Die attach-bondline (thickness)
Glass attach-bondline (thickness)
Imager to lid-outer surface
Imager to lid-inner surface
Imager to seating plane of package
Die thickness
Die center, X offset to the center of package
Die center, Y offset to the center of the package
Die position, X tilt to the Die Attach Plane
Die position, Y tilt to the Die Attach Plane
Die placement accuracy (referenced to die scribe and lead
fingers on package on all four sides)
Die rotation accuracy
Distance from PCB plane to top of the die surface
Distance from top of the die surface to top of the glass lid
Thickness
Spectral range for optical coating of window
Reflection coefficient for window (refer to
JESD22-B104C; Condition G
JESD22-B103B; Condition 1
Reflow profile according to J-STD-020D.1
Description
Figure
Figure 30. Side View Dimensions
30) and Mechanical Specifications (see
Rev. 9 | www.onsemi.com | Page 31 of 34
Description
Figure
0.500
1.520
0.030
0.030
1.270
Min
–
–
–
–
31)
0.550
0.060
0.070
1.570
1.300
(mm)
1.750
0.740
0.500
0.950
Typ
Package Drawing with Glass
0.600
1.980
0.090
1.330
0.110
Max
Min
400
–50
–50
N/A
N/A
–50
NA
0.5
–
–
–
–
–1
20
–
–
–
–
–
–
15 × 15
0.740
1.26
1.69
0.55
<0.8
Typ
0
0
1
1
0
–
–
–
–
–
NOII5SM1300A
1000
2000
2000
Max
N/A
N/A
260
NA
0.6
50
50
50
1
–
–
–
on page 30)
Units
mm
deg
deg
deg
mm
mm
mm
mm
µm
µm
µm
nm
Hz
°C
%
G