S29GL256S10DHI010 Spansion Inc., S29GL256S10DHI010 Datasheet - Page 93

• Manufacturer Part Number: S29GL256S10DHI010
• Manufacturer: Spansion Inc.

Specifications of S29GL256S10DHI010

• Lead Free Status / Rohs Status: Compliant

12. Ordering Information
February 11, 2011 S29GL_128S_01GS_00_01
The ordering part number for the General Market device is formed by a valid combination of the following:
S29GL01GS
D a t a
Device Number/Description
S29GL01GS, S29GL512S, S29GL256S, S29GL128S
3.0 Volt Core, with V
Manufactured on 65 nm MirrorBit Eclipse Process Technology
S h e e t
10
D
( A d v a n c e
H
IO
Option, 1024, 512, 256, 128 Megabit Page-Mode Flash Memory,
I
GL-S MirrorBit
01
0
I n f o r m a t i o n )
Packing Type
0 = Tray
3 = 13” Tape and Reel
9 = Wafer-in Wafer Jar
Model Number (V
01 = V
02 = V
V1 = V
V2 = V
Temperature Range
I
Package Materials Set
F = Lead Free (PB-Free)
H = Low Halogen, Pb-Free
E = 725 µm thickness without polyimide (wafer size 200 mm)
Package Type
D = Fortified Ball-Grid Array Package (LAE064) 9 mm x 9 mm
T = Thin Small Outline Package (TSOP) Standard Pinout
W = Wafer with KGD test flow
Speed Option
90 = 90 ns
10 = 100 ns
11 = 110 ns
12 = 120 ns
®
= Industrial (-40°C to +85°C)
Family
IO
IO
IO
IO
= V
= V
= 1.65 to 1.95V, V
= 1.65 to 1.95V, V
CC
CC
= 2.7 to 3.6V, highest address sector protected
= 2.7 to 3.6V, lowest address sector protected
IO
and V
CC
CC
CC
Range)
= 2.7 to 3.6V, highest address sector protected
= 2.7 to 3.6V, lowest address sector protected
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